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Microstructural evolution and interfacial reactions during active metal vacuum brazing of Ti (grade-2) and stainless steel (SS 304L) using a Ag-based alloy containing Cu, Ti, and Al was investigated. A Ni-depleted solid solution layer and a discontinuous layer of (Ni,Fe)₂TiAl intermetallic compound formed on the SS surface and adjacent to the SS-braze alloy interface, respectively. Three parallel contiguous layers of intermetallic compounds, CuTi, AgTi, and (Ag,Cu)Ti₂, formed at the Ti-braze alloy interface. The diffusion path for the reaction at this interface was established. Transmission electron microscopy revealed formation of nanocrystals of Ag-Cu alloy of size ranging between 20 and 30 nm in the unreacted braze alloy layer. The interdiffusion zone of β-Ti(Ag,Cu) solid solution, formed on the Ti side of the joint, showed eutectoid decomposition to lamellar colonies of α-Ti and internally twinned (Cu,Ag)Ti₂ …