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Capability to print metals at micro/nanoscale in arbitrary 3D patterns at local points of interest will have applications in nano-electronics and sensors. Meniscus-confined electrodeposition (MCED) is a manufacturing process that enables depositing metals from an electrolyte containing nozzle (pipette) in arbitrary 3D patterns. In this process, a meniscus (liquid bridge or capillary) between the pipette tip and the substrate governs the localized electrodeposition process. Fabrication of metallic microstructures using this process is a multi-physics process in which electrodeposition, fluid dynamics, and mass and heat transfer physics are simultaneously involved. We utilized multi-physics finite element simulation, guided by experimental data, to understand the effect of water evaporation from the liquid meniscus at the tip of the nozzle for deposition of free-standing copper microwires in MCED process.