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Recent advancements in electronics have renewed the interest in high strain rate nanoindentation testing, resulting in the development of new high strain rate nanoindentation test equipment and test methodologies. In this work, the current state-of-the-art in high strain rate nanoindentation testing is critically reviewed, with focus on three key aspects - the testing equipment's dynamic mechanical and electronic response, test methodology, and post-processing of raw data to obtain hardness and strain rate. The challenges in instrument hardware design and post-test data analysis are discussed, along with optimal strain rate window for accurate high strain rate measurements. Specific focus will be on instrumented high strain rate testing using self-similar indenters at strain rates in excess of 100 s⁻¹, wherein load and depth of penetration into the sample are both measured or applied.