作者
Thomas P Moffat, Daniel Wheeler, S-K Kim, Daniel Josell
发表日期
2007/11/20
期刊
Electrochimica Acta
卷号
53
期号
1
页码范围
145-154
出版商
Pergamon
简介
Superconformal electrodeposition is explained by the curvature enhanced adsorbate coverage (CEAC) mechanism. A CEAC model is used to quantitatively explain shape evolution during bottom-up “superfill” of trenches and vias. The bottom-up filling dynamic is seen to be a consequence of competitive adsorption between a rate suppressing polyethylene glycol-chloride layer (PEG-Cl) and a depassivating or rate accelerating species comprised of sulfonate-terminated propane thiol/disulfide and chloride (SPS-Cl). The SPS is the stronger surfactant and it adsorbs concurrently with displacement of the more rapidly formed PEG-Cl layer; growth on non-planar geometries thus leads to enrichment of SPS on advancing concave surfaces and dilution on convex sections. Because the metal deposition rate rises monotonically with the local accelerator (SPS-Cl) surface coverage, this yields positive feedback that naturally …
引用总数
学术搜索中的文章
TP Moffat, D Wheeler, SK Kim, D Josell - Electrochimica Acta, 2007