作者
Bernhard E Boser, Roger T Howe
发表日期
1996/3
期刊
IEEE Journal of solid-state circuits
卷号
31
期号
3
页码范围
366-375
出版商
IEEE
简介
Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or bipolar/MOS integrated circuits. Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits. Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 /spl mu/g//spl radic/(Hz). For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response.
引用总数
学术搜索中的文章
BE Boser, RT Howe - IEEE Journal of solid-state circuits, 1996