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As DRAM cells continue to shrink, they become more susceptible to retention failures. DRAM cells that permanently exhibit short retention times are fairly easy to identify and repair through the use of memory tests and row and column redundancy. However, the retention time of many cells may vary over time due to a property called Variable Retention Time (VRT). Since these cells intermittently transition between failing and non-failing states, they are particularly difficult to identify through memory tests alone. In addition, the high temperature packaging process may aggravate this problem as the susceptibility of cells to VRT increases after the assembly of DRAM chips. A promising alternative to manufacture-time testing is to detect and mitigate retention failures after the system has become operational. Such a system would require mechanisms to detect and mitigate retention failures in the field, but would be …