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This paper focusses on comparison of the performance of Circular Microstrip Patch Antenna(CMPA) in S-band between CMPA with soil as substrate and CMPA with RT/Duroid 5880 as substrate. RT/Duroid 5880 is commonly used in the fabrication of Microstrip Patch Antennas (MPA) due to its low electrical loss, low dielectric loss, low moisture absorption etc. However, it is costly. This work tries to prove that soil substrate can be one of the contenders in the future to replace RT/Duroid 5880. The simulation is carried out in Computational Electromagnetic Software FEKO (suite 7.0). The paper concludes by stating that soil substrate being economical can be a potential candidate to replace RT/Duroid 5880 as there is very little to minimal change in key parameters such as bandwidth (a difference of 14.07 MHz), gain (a difference of 0.18 dBi) and directivity (a difference of 0.41 dBi) when the simulation results are compared.