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BACKGROUND

Optical signals may be used to communicate information between integrated circuits (ICs) such as ICs formed on dif ferent dies. Present techniques to optically couple different dies may be incompatible with high Volume manufacturing processes. For example, optical features of different dies may presently be aligned and coupled using active alignment tech niques where a light signal is routed between the dies while fabrication equipment positions the dies relative to one another until precise alignment is achieved to provide maxi mum coupling (eg, maximum light intensity, minimum cou pling loss, etc.). Such precise alignment of optical features to route the light signal may be costly and time-consuming.