作者
Jacopo Iannacci, Flavio Giacomozzi, Sabrina Colpo, Benno Margesin, M Bartek
发表日期
2009/5/18
研讨会论文
IEEE EUROCON 2009
页码范围
1197-1205
出版商
IEEE
简介
In this paper we present a power attenuator for RF (radiofrequency) and microwave signals entirely designed in MEMS (microelectromechanical-system) technology. It is fabricated in the RF-MEMS technology available at Fondazione Bruno Kessler (FBK) based on a surface micromachining process. The network is realized in a low-cost manufacturing process and its dimensions are significantly compact compared to traditional implementations of RF power attenuators. More interestingly, employment of MEMS technology for such architecture enables a very large reconfigurability, making the network compatible with different standards and usable in several wireless communication systems. Electromechanical and RF behaviour of the discussed network are simulated and compared against experimental results collected by the first fabricated samples. RF measured performances are rather promising in spite a …
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