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3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern systems by leveraging through silicon vias (TSVs) to deliver higher external memory channel bandwidth. Today’s systems, however, cannot fully utilize the higher bandwidth offered by TSVs, due to the limited internal bandwidth within each layer of the 3D-stacked DRAM. We identify that the bottleneck to enabling higher bandwidth in 3D-stacked DRAM is now the global bitline interface, the connection between the DRAM row buffer and the peripheral IO circuits. The global bitline interface consists of a limited and expensive set of wires and structures, called global bitlines and global sense amplifiers, whose high cost makes it difficult to simply scale up the bandwidth of the interface within a single DRAM layer in the 3D stack. We alleviate this bandwidth bottleneck by exploiting the observation that several global bitline …