作者
Jung-Sik Kim, Chi Sung Oh, Hocheol Lee, Donghyuk Lee, Hyong Ryol Hwang, Sooman Hwang, Byongwook Na, Joungwook Moon, Jin-Guk Kim, Hanna Park, Jang-Woo Ryu, Kiwon Park, Sang Kyu Kang, So-Young Kim, Hoyoung Kim, Jong-Min Bang, Hyunyoon Cho, Minsoo Jang, Cheolmin Han, Jung-Bae LeeLee, Joo Sun Choi, Young-Hyun Jun
发表日期
2011/9/23
期刊
IEEE Journal of Solid-State Circuits
卷号
47
期号
1
页码范围
107-116
出版商
IEEE
简介
A 1.2 V 1 Gb mobile SDRAM, having 4 channels with 512 DQ pins has been developed with 50 nm technology. It exhibits 330.6 mW read operating power during 4 channel operation, achieving 12.8 GB/s data bandwidth. Test correlation techniques to verify functions through micro bumps and test pads have been developed. Block based dual period refresh scheme is applied to reduce self refresh current with minimum chip size burden. Stacking of 2 dies with 7.5 μm diameter and 40 μm pitch TSVs has been fabricated and tested, which results in 76% overall package yield without difference in performances between top and bottom die.
引用总数
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学术搜索中的文章
JS Kim, CS Oh, H Lee, D Lee, HR Hwang, S Hwang… - IEEE Journal of Solid-State Circuits, 2011