作者
Sahil Thappa, Shubham Kumar Verma, Vibhushit Gupta, Sanjay Sharma, Yatheshth Anand, Sanjeev Anand
发表日期
2024/1/1
图书
Enriched Numerical Techniques
页码范围
361-377
出版商
Academic Press
简介
Thermal conductive thin films are found to be applicable in the field of thermal absorption, and their advancements have been reported for better thermal stability and efficiency. Since the thermal stability and efficiency depend on the coating resistance to surface wear, it means the surface needs to be analyzed for such stresses. The common wear conditions of a thermal absorptive coating occur when the thermal stresses induced into the coating material make the coating surface to crack and fracture in extremely hot environment. The fractures and cracks can be modeled using numerical modeling, which affirms how the discontinuities are propagating on the coating surface. Advancements in the field of numerical modeling have been proposed, so that the surface fractures can be modeled more accurately and precisely. For precise results, nonconformal and representation of accurate geometries are required …
学术搜索中的文章
S Thappa, SK Verma, V Gupta, S Sharma, Y Anand… - Enriched Numerical Techniques, 2024