作者
Yihao Fang, Hsin-Ying Tseng, Mark JW Rodwell
发表日期
2019/6/23
研讨会论文
2019 Device Research Conference (DRC)
页码范围
179-180
出版商
IEEE
简介
We report DC results from a We=100nm InP/InGaAs DHBT technology with a self-aligned MOCVD regrown GaAs extrinsic base providing low base access resistance Rbb while maintaining acceptable DC current gain β. A 0.09×5μm 2 transistor exhibits a base contact resistivity ρ c =1Ω-μm 2 , and a peak β ~ 15. The HBTs exhibit a common-emitter breakdown voltage BVCEO=3.6V(JC=10μA/μm 2 ). According to the general scaling law for InP HBTs in [1], the low ρ c meets the requirement for f max =2.8THz operation.
引用总数