发明者
Kostas Papathomas, Mark D Poliks, David W Wang, Frederick R Christie
发表日期
1993/3/16
专利局
US
专利号
5194930
专利申请号
07760654
简介
Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
引用总数
学术搜索中的文章
K Papathomas, MD Poliks, DW Wang, FR Christie - US Patent 5,194,930, 1993