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Silicon-on-insulator (SOI) provides an important material system for photonic-electronic integration. Further integration of mechanical devices in SOI is hampered by incompatible under-etch or release steps required to prevent leakage of mechanical energy into the substrate. The purpose of this work is to demonstrate co-integration of nanomechanical structures on the surface of SOI. Silicon fin waveguides are used to generate co-localized and interacting optical and mechanical resonances. Radiation pressure interaction from laser driving is demonstrated. Our work enables co-integration of electronic, photonic, and phononic degrees of freedom on a single platform.