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Semiconductor manufacturers aim to fabricate defect-free wafers in order to improve product quality, increase yields, and reduce costs. Typically, wafer defects form spatial patterns that provide useful information, helping to identify problems and faults during the fabrication process. Machine learning (ML) methods have been used to classify these defects in order to locate the root causes of failure. This paper proposes a novel deep-structured ML approach as an extension of our previous randomized general regression network (RGRN) model, to identify and classify both single-defect and mixed-defect patterns. The principal motivation for this paper is that a shallow-structured RGRN performs well on single-pattern defects, achieving an accuracy of 99.8%, but performs poorly when a wafer has mixed-defect patterns. The proposed approach improves RGRN performance, particularly on mixed-pattern defects, by …