作者
Kan Li†, Xu Cheng†, Feng Zhu, Linze Li, Zhaoqian Xie, Haiwen Luan, Zhouheng Wang, Ziyao Ji, Heling Wang, Fei Liu, Yeguang Xue, Changqing Jiang, Xue Feng, Luming Li, John A Rogers, Yonggang Huang, Yihui Zhang
发表日期
2019/2
期刊
Advanced Functional Materials
卷号
29
期号
8
页码范围
1806630
简介
Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two‐dimensional (2D) serpentine configurations, 2D fractal‐inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while …
引用总数
20192020202120222023202472239372711
学术搜索中的文章
K Li, X Cheng, F Zhu, L Li, Z Xie, H Luan, Z Wang, Z Ji… - Advanced Functional Materials, 2019