Gang Duan

Gang Duan

Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：4954
Chip Packaging Heterogeneous Integration Die Embedding HDI Substrates Package Assembly
Chintan Buch

Chintan Buch

AMD
被引用次数：117
Chip Packaging 2.5/3D Packaging
Pallabi Das

Pallabi Das

Principal Engineer at Global Foundries; PhD at IIT Bombay
在 globalfoundries.com 的电子邮件经过验证
被引用次数：66
Chip packaging Mechanical and Thermal modeling in TCAD Semiconductor devices Photonics
Nithya Sankaran

Nithya Sankaran

NVIDIA Corporation
被引用次数：48
Chip Packaging