Cheng Yang (杨诚)

Cheng Yang (杨诚)

Graduate School at Shenzhen,Tsinghua University
被引用次数：25979
Electrochemistry applications Electronic packaging materials
Mailadil Thomas Sebastian

Mailadil Thomas Sebastian

Chief Scientist retired, CSIR-National Institute for Interdisciplinary Science and Technology
在 ee.oulu.fi 的电子邮件经过验证
被引用次数：16177
materials for wireless communication EMI shielding electronic packaging materials
Haseeb A S M A

Haseeb ASMA

Professor, Dept. of Nanomaterials and Ceramic Eng., Bangladesh Univ. of Eng. & Tech …
在 nce.buet.ac.bd 的电子邮件经过验证
被引用次数：11317
Nanostructured materials electronic packaging materials materials degradation in harsh environment
Ziyin Lin

Ziyin Lin

Intel Corporation
在 gatech.edu 的电子邮件经过验证
被引用次数：11156
electronic packaging materials Carbon nanomaterials for energy storage and …
Wei Lin

Wei Lin

georgia institute of technology, IBM@Albany Nanotech; present: Apple Inc. HW R&D
在 apple.com 的电子邮件经过验证
被引用次数：4397
carbon materials polymer composite electronic packaging materials thermal management metal oxide catalyst
Mohd Arif Anuar Mohd Salleh

Mohd Arif Anuar Mohd Salleh

University Malaysia Perlis
在 unimap.edu.my 的电子邮件经过验证
被引用次数：2244
Electronic Packaging Materials Metallurgy Soldering Solidification Interconnects
徐菊

徐菊

professor of Institute of Electrical Engineering, Chinese Academy of Sciences
在 mail.iee.ac.cn 的电子邮件经过验证
被引用次数：991
Thermoelectric materials and devices electronic packaging materials dielectric materials soft magnetic materials
Gwang-Mun Choi

Gwang-Mun Choi

Electronics and Telecommunications Research Institute
在 etri.re.kr 的电子邮件经过验证
被引用次数：856
Electronic Packaging Materials Epoxy-based Solder Pastes Sol-Gel Chemistry Siloxane Hybrid Materials Flexible Hard Coatings
Dr. Md Muktadir Billah

Dr. Md Muktadir Billah

Bangladesh University of Engineering and Technology, University of Central Florida
在 knights.ucf.edu 的电子邮件经过验证
被引用次数：361
Nanomaterials and Thin Films Nanocomposites Electronic Packaging Materials
Rabiatul Adawiyah Binti Mohamed Anuar

Rabiatul Adawiyah Binti Mohamed Anuar

Faculty of Mechanical & Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia
在 siswa.uthm.edu.my 的电子邮件经过验证
被引用次数：92
Materials Engineering Electronic Packaging Materials
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