Jud Ready

Jud Ready

Principal Research Engineer & Adj. Professor
在 gatech.edu 的电子邮件经过验证
被引用次数：2377
Electronics reliability nanomaterials
Craig Hillman

Craig Hillman

DfR Solutions
在 dfrsolutions.com 的电子邮件经过验证
被引用次数：1500
Electronics Reliability Electronics Packaging
Bohwan Choi

Bohwan Choi

Samsung Research, Samsung Electronics
在 samsung.com 的电子邮件经过验证
被引用次数：1442
Wireless power transfer DC Converter Electronics Reliability
Stoyan Stoyanov

Stoyan Stoyanov

Professor in Computational Engineering, University of Greenwich, London, UK
在 gre.ac.uk 的电子邮件经过验证
被引用次数：1183
Computational Mechanics FE Modelling Electronics Reliability Computational Intelligence
Babak Kondori

Babak Kondori

Senior Reliability Engineer, SpaceX
被引用次数：988
Electronics Reliability Materials Science Solid Mechanics Ductile Fracture of Metals Dislocation Dynamics
Vikas Yadav

Vikas Yadav

ATTD Q&R Engineer at Intel Corporation
在 tigermail.auburn.edu 的电子邮件经过验证
被引用次数：585
Electronics Reliability Solder Joint Reliability
Seyab Khan

Seyab Khan

PhD student, Technical university Delft
在 tudelft.nl 的电子邮件经过验证
被引用次数：522
Electronics reliability
Francy John Akkara

Francy John Akkara

Ph.D. Candidate
在 auburn.edu 的电子邮件经过验证
被引用次数：522
Electronics reliability lead free solder joints thermal cycling reliability
Hannes Greve

Hannes Greve

Quality Reliability Engineer, Intel Corporation
在 umd.edu 的电子邮件经过验证
被引用次数：279
electronics reliability electronics packaging high temperature electronics solder transient liquid phase sintering
Julie Silk

Julie Silk

Keysight Technologies
在 keysight.com 的电子邮件经过验证
被引用次数：223
Electronics reliability
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