Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
在 tsmc.com 的电子邮件经过验证
被引用次数：47675
packaging 3D microelectronics interconnect semiconductor
Andre DeHon

Andre DeHon

University of Pennsylvania
在 acm.org 的电子邮件经过验证
被引用次数：16365
Spatial Computing FPGAs Reconfigurable Interconnect Hardware Security
Daniel C. Edelstein

Daniel C. Edelstein

IBM
在 us.ibm.com 的电子邮件经过验证
被引用次数：14491
Physics Optics Microelectronics Engineering Interconnect
N Singh

N Singh

Brown University, Caterpillar Inc
在 alumni.brown.edu 的电子邮件经过验证
被引用次数：8537
mechanics materials Interconnect packaging
Ajay Kumar

Ajay Kumar

Research Scholar
在 nith.ac.in 的电子邮件经过验证
被引用次数：4894
Interconnect
Mohammad Hossein Moaiyeri

Mohammad Hossein Moaiyeri

Associate Professor of Electronics and Computer Engineering, Shahid Beheshti University …
在 sbu.ac.ir 的电子邮件经过验证
被引用次数：4890
Emerging Technologies Approximate Computing In-Memory Computing Interconnect
Xin-Ping Qu

Xin-Ping Qu

Fudan university
在 fudan.edu.cn 的电子邮件经过验证
被引用次数：4017
interconnect silicide ZnO nanoimprint
Arkadiy Morgenshtein

Arkadiy Morgenshtein

Medtronic (Given Imaging), Technion
在 technion.ac.il 的电子邮件经过验证
被引用次数：1966
VLSI low-power circuits interconnect
Nick van der Meijs

Nick van der Meijs

Delft University of Technology
在 tudelft.nl 的电子邮件经过验证
被引用次数：1868
Electrical Engineering Micro electronics Design Automation Modeling Interconnect
Professor Imed Ben Dhaou

Professor Imed Ben Dhaou

University of Turku and Dar Al-Hekma University
在 utu.fi 的电子邮件经过验证
被引用次数：1796
VLSI for DSP low-power design embedded system design for IoT approximated computing Interconnect
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