David A B Miller

David AB Miller

Stanford University
在 ee.stanford.edu 的电子邮件经过验证
被引用次数：56711
Optics optoelectronics quantum mechanics physics interconnects
Yeshaiahu Fainman

Yeshaiahu Fainman

Professor of ECE, University of California San Diego
在 ucsd.edu 的电子邮件经过验证
被引用次数：23950
Photonics Optics Optoelectronics Interconnects
Daniel Josell

Daniel Josell

NIST
在 nist.gov 的电子邮件经过验证
被引用次数：8129
Interconnects Electrodeposition Photovoltaics Materials
Brajesh Kumar Kaushik

Brajesh Kumar Kaushik

Professor of Electronics and Communication Engg., IIT-Roorkee
在 iitr.ac.in 的电子邮件经过验证
被引用次数：7367
Spintronics VLSI Image processing Interconnects Biosensors
Sriram Muthukumar

Sriram Muthukumar

EnLiSense LLC
在 enlisense.com 的电子邮件经过验证
被引用次数：5456
Medical Wearables AI/Datascience Packaging Interconnects
Cary Y Yang

Cary Y Yang

Professor of Electrical and Computer Engineering, Santa Clara University
在 scu.edu 的电子邮件经过验证
被引用次数：5057
Nanocarbons interconnects 2D materials and devices
Hiren Thacker

Hiren Thacker

Cisco Systems
在 tech301.com 的电子邮件经过验证
被引用次数：4698
Photonics packaging Microsystem integration and packaging Interconnects Medical Devices
E. Todd Ryan

E. Todd Ryan

Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：4510
EUV lithography/patterning interconnects plasma chemistry materials science
Gordon A. Keeler

Gordon A. Keeler

Beacon Photonics, DARPA, Sandia National Laboratories, Stanford University
在 beaconphotonics.com 的电子邮件经过验证
被引用次数：3985
optoelectronics photonic materials interconnects sensors optical microsystems
Maciej Besta

Maciej Besta

ETH Zurich
在 inf.ethz.ch 的电子邮件经过验证
被引用次数：3366
Irregular Computations Graph Computations Sparse Computations Interconnects HPC
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