Souvik Ghosh

Souvik Ghosh

R&D Engineer, IMEC
在 imec.be 的电子邮件经过验证
被引用次数：645
Semiconductor packaging 2D materials Layer transfer wafer bonding
Benjamin T.-H. Lee

Benjamin T.-H. Lee

National Central University
在 ncu.edu.tw 的电子邮件经过验证
被引用次数：556
wafer bonding layer transfer Ion-Cut Smart-Cut porous silicon
Ravi Pathak

Ravi Pathak

Department of Physics, IIT Delhi
被引用次数：217
Semiconductors Wafer bonding Layer transfer
Sanghyun Park

Sanghyun Park

Korea Advanced Institute of Science and Technology
在 kaist.ac.kr 的电子邮件经过验证
被引用次数：159
Silicon Germanium Thin film single crystal Layer transfer