Jeong-Won Yoon

Jeong-Won Yoon

Associate Professor, Chungbuk National University
在 chungbuk.ac.kr 的电子邮件经过验证
被引用次数：5329
Micro Electronic Packaging Package Material/Process/Reliability Power Electronic Packaging
Dr. Muhannad Mustafa

Dr. Muhannad Mustafa

Mechanical Engineer at Applied Materials
在 auburn.edu 的电子邮件经过验证
被引用次数：689
Tribology Micro Electronic Packaging Atomic Layer Deposition
Kyung-Eun Min

Kyung-Eun Min

Postdoctoral fellow, Portland State University
在 pdx.edu 的电子邮件经过验证
被引用次数：119
Renewable energy storage system Phase change materials micro-electronic packaging non-conductive paste