Bo Song

Bo Song

HP Inc
在 gatech.edu 的电子邮件经过验证
被引用次数：3322
Microelectronic Packaging ICs Polymer Materials Nanotechnology
Henning Braunisch

Henning Braunisch

Principal Engineer, Components Research, Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：3299
Microelectronic Packaging Applied Electromagnetics
Liyi Li

Liyi Li

Sr. Materials and Failure Analysis Engineer, Intel Corporation
在 gatech.edu 的电子邮件经过验证
被引用次数：3029
Microfabrication Microelectronic Packaging Microelectronic Materials and Failure Analysis
Telesphor Kamgaing

Telesphor Kamgaing

Research Scientist, Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：2812
wireless systems microelectronic packaging radio millimeter wave microwave
Kemal Aygun

Kemal Aygun

Fellow, Assembly and Test Technology Development, Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：2544
Microelectronic Packaging Applied Electromagnetics
MK Abdullah

MK Abdullah

Sr. Lecturer, Material & Min. Res. Engineering, Universiti Sains Malaysia
在 usm.my 的电子邮件经过验证
被引用次数：2420
Ansys Microelectronic Packaging Plastic Processing Microelectronic Cooling Polymer Simulation
Mohit Bhatia

Mohit Bhatia

Intel Corp., The Ohio State University
在 intel.com 的电子邮件经过验证
被引用次数：1644
Advance Packaging Superconductors Semiconductors Microelectronic Packaging
Fuliang Wang

Fuliang Wang

Central South University
在 csu.edu.cn 的电子邮件经过验证
被引用次数：1454
Microelectronic packaging
David Danovitch

David Danovitch

Professor of Electrical and Computor Engineering, Université de Sherbrooke
在 usherbrooke.ca 的电子邮件经过验证
被引用次数：1319
microelectronic packaging interconnection solder metallurgy
Amy Moll

Amy Moll

Professor of Materials Science & Engineering, Boise State University
在 boisestate.edu 的电子邮件经过验证
被引用次数：1261
Engineering Education Compound Semiconductors Microelectronic Packaging MEMS
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