Hiren Thacker

Hiren Thacker

Cisco Systems
在 tech301.com 的电子邮件经过验证
被引用次数：4619
Photonics packaging Microsystem integration and packaging Interconnects Medical Devices
Jeroen Missinne

Jeroen Missinne

Professor at Ghent University and imec
在 ugent.be 的电子邮件经过验证
被引用次数：1211
photonics packaging optical sensors flexible photonics optogenetics laser technology
Arun Kumar Mallik

Arun Kumar Mallik

Senior Engineer , Photonics Packaging Group,Tyndall National Institute
在 tyndall.ie 的电子邮件经过验证
被引用次数：964
Fiber Optic Sensor Integrated optics Photonics packaging
How Yuan Hwang

How Yuan Hwang

Tyndall National Institute
在 tyndall.ie 的电子邮件经过验证
被引用次数：633
Materials Process Integration Electronics Packaging Photonics Packaging
Krzysztof Nieweglowski

Krzysztof Nieweglowski

Technische Universität Dresden, Institute of Electronic Packaging Technology
在 tu-dresden.de 的电子邮件经过验证
被引用次数：389
photonics packaging
Francesco Floris

Francesco Floris

Department of Physics, University of Pavia
在 unipv.it 的电子邮件经过验证
被引用次数：344
Photonics Packaging Nanotechnologies Plasmonics Sensing
AHMED ELMOGI

AHMED ELMOGI

Sentea
在 senteatech.com 的电子邮件经过验证
被引用次数：215
photonics packaging optoelectronics integrated photonics electronics
A. Serrano Rodrigo

A. Serrano Rodrigo

Camgraphic
在 camgraphic-technology.com 的电子邮件经过验证
被引用次数：161
Photonics photonics packaging photonics integration
Nivesh Mangal

Nivesh Mangal

imec-UGent, Belgium
在 imec.be 的电子邮件经过验证
被引用次数：132
Silicon Photonics Photonics Packaging Micro-optics
Sharon M. Butler

Sharon M. Butler

Postdoctoral Researcher, Tyndall National Institute
在 tyndall.ie 的电子邮件经过验证
被引用次数：58
Photonics Packaging Laser Integration Photonic Crystals Nanophotonics
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