Hau Ping Chan

Hau Ping Chan

City University of Hong Kong
在 cityu.edu.hk 的电子邮件经过验证
被引用次数：2743
Photonics Polymer THz devices Reliability and Failure Analysis
Shafiq.I

Shafiq.I

City University of Hong Kong
在 my.cityu.edu.hk 的电子邮件经过验证
被引用次数：1017
Injection Moulding Vacuum forming Electronic Packaging Nanomaterials Reliability and Failure Analysis
Fei Cao

Fei Cao

Google
在 google.com 的电子邮件经过验证
被引用次数：1010
Reliability and failure analysis
Bassem Mouawad

Bassem Mouawad

University of Nottingham
在 nottingham.ac.uk 的电子邮件经过验证
被引用次数：767
Materials Science Silicon Carbide power electronics packaging Reliability and Failure analysis Embedding Power Electronic Pac
Hariram Mohanram

Hariram Mohanram

PhD Student in Material Science, University of Texas at Arlington
在 uta.edu 的电子邮件经过验证
被引用次数：13
Materials science semiconductor Packaging Reliability and Failure Analysis