Sangjun Park

Sangjun Park

Lam Research
在 lamresearch.com 的电子邮件经过验证
被引用次数：946
MEMS Semiconductors microfabrication RIE dry etch
Varvara Brackmann

Varvara Brackmann

Group Leader at Fraunhofer IPMS-CNT
在 ipms.fraunhofer.de 的电子邮件经过验证
被引用次数：454
semiconductor instrumental analytics e-beam direct write RIE Metrology
Jessica Dechene

Jessica Dechene

IBM
在 dechene.ca 的电子邮件经过验证
被引用次数：409
Semiconductors RIE Surface Science Material Science
Emerson Candido de Oliveira

Emerson Candido de Oliveira

System Engineer, LayTec AG
在 physik.uni-kl.de 的电子邮件经过验证
被引用次数：278
III-V semiconductors RIE Graphene 2D materials Plasmonics
Vamsi Krishna Reddy Kondapalli

Vamsi Krishna Reddy Kondapalli

Process Engineer, Intel Corporation; MSE Ph.D. University of Cincinnati
在 mail.uc.edu 的电子邮件经过验证
被引用次数：64
Carbon Nanomaterials CVD PVD RIE Spectroscopy
Ivo Otto IV

Ivo Otto IV

College of Nanotechnology, Science, and Engineering (CNSE) at the University of Albany
在 sunypoly.edu 的电子邮件经过验证
被引用次数：11
semiconductor selective deposition atomic layer etching RIE radical etching
Jörn Achtelik

Jörn Achtelik

Student, University of Paderborn
在 mail.uni-paderborn.de 的电子邮件经过验证
被引用次数：4
Physics Nanotechnology Nanospheres Lithography RIE