Kazuhiro Nogita

Kazuhiro Nogita

Professor of Materials Engineering, The University of Queensland
在 uq.edu.au 的电子邮件经过验证
被引用次数：10668
Soldering Intermetallics Solidification Nuclear materials Hydrogen storage
hwa-teng Lee

hwa-teng Lee

National Cheng Kung University
在 mail.ncku.edu.tw 的电子邮件经过验证
被引用次数：3213
soldering weldimg EDM residual stress Material testing
Guang Zeng

Guang Zeng

Central South University, China
在 csu.edu.cn 的电子邮件经过验证
被引用次数：2900
Soldering Intermetallics Solidification X-ray Microscopy
Azman Jalar

Azman Jalar

institute of microengineering and nanoelectronics (IMEN), universiti kebangsaan malaysia
在 ukm.edu.my 的电子邮件经过验证
被引用次数：2606
solder soldering wire bonding electronics packaging stereometry
Dr. ALI OURDJINI

Dr. ALI OURDJINI

University of Ottawa
在 uottawa.ca 的电子邮件经过验证
被引用次数：2497
Light Metals Solidification Soldering Biomaterials
Mohd Arif Anuar Mohd Salleh

Mohd Arif Anuar Mohd Salleh

University Malaysia Perlis
在 unimap.edu.my 的电子邮件经过验证
被引用次数：2251
Electronic Packaging Materials Metallurgy Soldering Solidification Interconnects
Fan Gao

Fan Gao

Chemical engineering, University of Massachusetts Lowell
在 uml.edu 的电子邮件经过验证
被引用次数：1468
Nanotechnology Electronics Assembly Packaging Soldering
Mu穆, DeKui德魁

Mu穆, DeKui德魁

Institute of manufacturing, Huaqiao University
在 uqconnect.edu.au 的电子邮件经过验证
被引用次数：1363
Soldering Packaging Brazing Manufacturing Technologies/Tools
Xinfang Zhang (张新房)

Xinfang Zhang (张新房)

Imperial College London
被引用次数：1211
Welding Soldering Metallurgy Materials
Fakhrozi Che Ani

Fakhrozi Che Ani

Institute of Microengineering and Nanoelectronics (IMEN), The National University of …
在 jabil.com 的电子邮件经过验证
被引用次数：1122
Soldering Surface Mount Technology Electronic packaging
1 - 10