Sehoon Yoo

Sehoon Yoo

Korea Institute of Industrial Technology, KITECH
在 kitech.re.kr 的电子邮件经过验证
被引用次数：1375
electronic packaging solder joining flip chip bonding surface mount technology
Fakhrozi Che Ani

Fakhrozi Che Ani

Institute of Microengineering and Nanoelectronics (IMEN), The National University of …
在 jabil.com 的电子邮件经过验证
被引用次数：1103
Soldering Surface Mount Technology Electronic packaging
Mohd Sharizal Abdul Aziz

Mohd Sharizal Abdul Aziz

Senior Lecturer in School of Mechanical Engineering at Universiti Sains Malaysia
在 usm.my 的电子邮件经过验证
被引用次数：1061
Computational Fluid Dynamics Fluid-structure interaction Surface Mount Technology Soldering Reflow soldering
Muhammad Firdaus Mohd Nazeri

Muhammad Firdaus Mohd Nazeri

School of Materials Engineering, Universiti Malaysia Perlis
在 unimap.edu.my 的电子邮件经过验证
被引用次数：645
Lead-free solder Intermetallic Soldering Surface mount technology
Nourma Khader

Nourma Khader

Koh Young America Inc./ Binghamton University
在 binghamton.edu 的电子邮件经过验证
被引用次数：281
Data Mining Optimization Surface Mount Technology Smart Factory Pharmacy Informatics
Lei Nie

Lei Nie

Hardware Reliability Engineer, Lab126
在 lab126.com 的电子邮件经过验证
被引用次数：111
Electronic Packaging System and Component Reliability Surface Mount Technology Process of First and Second Level …
VISHNU BUSI REDDY

VISHNU BUSI REDDY

Process Engineer
在 intel.com 的电子邮件经过验证
被引用次数：49
Surface Mount Technology Equipment Development Semiconductor Packaging Metrology
Suresh Kumar Duguta

Suresh Kumar Duguta

Research Scholar
被引用次数：6
Microelectronics Packaging Technologies … Lead-free solders Surface Mount Technology Isothermal-Solidification Intermet
Sugadh Bakare

Sugadh Bakare

SUNY Binghamton
在 binghamton.edu 的电子邮件经过验证
被引用次数：4
Surface Mount Technology Second Level Interconnect Co-package Optics
Calvin Ling

Calvin Ling

Graduate Researcher, Universiti Sains Malaysia
在 student.usm.my 的电子邮件经过验证
被引用次数：2
Surface Mount Technology Machine Learning