Matthew Thorum

Matthew Thorum

Micron Technology
在 micron.com 的电子邮件经过验证
被引用次数：1999
Electrodeposition Electrocatalysis TSV Advanced Packaging
Premachandran Chirayarikathuveedu (C S Premachandran)

Premachandran Chirayarikathuveedu (CS Premachandran)

GLOBALFOUNDRIES US Inc.
在 globalfoundries.com 的电子邮件经过验证
被引用次数：1446
MEMS TSV CPI Packaging 3DIC
Olugbenga Famodu

Olugbenga Famodu

GLOBALFOUNDRIES US Inc.
在 globalfoundries.com 的电子邮件经过验证
被引用次数：1441
Thin Films Electronic Materials and Packaging TSV MEMS Combinatorial Synthesis
Aditya Kumar

Aditya Kumar

GLOBALFOUNDRIES US Inc.
在 globalfoundries.com 的电子邮件经过验证
被引用次数：1273
Thin Films Electronic Materials and Packaging TSV MEMS
Tapobrata Bandyopadhyay

Tapobrata Bandyopadhyay

Electrical Design Engineer, Texas Instruments
在 ti.com 的电子邮件经过验证
被引用次数：1219
Signal Integrity Power Integrity 3D Interposer Packaging TSV.
Steve Groothuis

Steve Groothuis

Ayar Labs, Incorporated
在 ayarlabs.com 的电子邮件经过验证
被引用次数：1193
Package Technology silicon photonics TSV Interposers
Vijay Sukumaran

Vijay Sukumaran

Senior R&D Engineer, PsiQuantum
在 psiquantum.com 的电子邮件经过验证
被引用次数：1074
Semiconductors Advanced IC packaging Glass interposer Packaging TSV
Simon J. Bleiker

Simon J. Bleiker

PhD Student in Micro and Nanosystmes, KTH Royal Institute of Technology
在 kth.se 的电子邮件经过验证
被引用次数：842
MEMS NEMS Nano Switch TSV electromechanical computing
Naoya WATANABE

Naoya WATANABE

National Institute of Advanced Industrial Science and Technology (AIST)
在 aist.go.jp 的电子邮件经过验证
被引用次数：831
TSV bump bonding 3D IC
Defu Liang

Defu Liang

University of Virginia
在 virginia.edu 的电子邮件经过验证
被引用次数：558
Electrodeposition of alloys Wafer Level Packaging TSV Cu Pillars Au bumping
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