| Factors affecting thermal conductivities of the polymers and polymer composites: A review Y Guo, K Ruan, X Shi, X Yang, J Gu Composites Science and Technology 193, 108134, 2020 | 587 | 2020 |
| Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene … X Yang, S Fan, Y Li, Y Guo, Y Li, K Ruan, S Zhang, J Zhang, J Kong, J Gu Composites Part A: Applied Science and Manufacturing 128, 105670, 2020 | 553 | 2020 |
| Significantly enhanced and precisely modeled thermal conductivity in polyimide nanocomposites with chemically modified graphene via in situ polymerization and electrospinning … Y Guo, G Xu, X Yang, K Ruan, T Ma, Q Zhang, J Gu, Y Wu, H Liu, Z Guo Journal of Materials Chemistry C 6 (12), 3004-3015, 2018 | 397 | 2018 |
| Highly thermally conductive flame-retardant epoxy nanocomposites with reduced ignitability and excellent electrical conductivities J Gu, C Liang, X Zhao, B Gan, H Qiu, Y Guo, X Yang, Q Zhang, DY Wang Composites Science and Technology 139, 83-89, 2017 | 383 | 2017 |
| Thermal transport in polymeric materials and across composite interfaces N Mehra, L Mu, T Ji, X Yang, J Kong, J Gu, J Zhu Applied Materials Today 12, 92-130, 2018 | 364 | 2018 |
| Functionalized graphite nanoplatelets/epoxy resin nanocomposites with high thermal conductivity J Gu, X Yang, Z Lv, N Li, C Liang, Q Zhang International Journal of Heat and Mass Transfer 92, 15-22, 2016 | 364 | 2016 |
| Enhanced thermal conductivities and decreased thermal resistances of functionalized boron nitride/polyimide composites Y Guo, Z Lyu, X Yang, Y Lu, K Ruan, Y Wu, J Kong, J Gu Composites Part B: Engineering 164, 732-739, 2019 | 344 | 2019 |
| A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods X Yang, C Liang, T Ma, Y Guo, J Kong, J Gu, M Chen, J Zhu Advanced composites and hybrid materials 1, 207-230, 2018 | 317 | 2018 |
| Reduced graphene oxide heterostructured silver nanoparticles significantly enhanced thermal conductivities in hot-pressed electrospun polyimide nanocomposites Y Guo, X Yang, K Ruan, J Kong, M Dong, J Zhang, J Gu, Z Guo ACS applied materials & interfaces 11 (28), 25465-25473, 2019 | 292 | 2019 |
| Self-healing, recoverable epoxy elastomers and their composites with desirable thermal conductivities by incorporating BN fillers via in-situ polymerization X Yang, Y Guo, X Luo, N Zheng, T Ma, J Tan, C Li, Q Zhang, J Gu Composites Science and Technology 164, 59-64, 2018 | 286 | 2018 |
| Highly thermal conductivities, excellent mechanical robustness and flexibility, and outstanding thermal stabilities of aramid nanofiber composite papers with nacre-mimetic … T Ma, Y Zhao, K Ruan, X Liu, J Zhang, Y Guo, X Yang, J Kong, J Gu ACS Applied Materials & Interfaces 12 (1), 1677-1686, 2019 | 274 | 2019 |
| Enhanced thermal conductivities of epoxy nanocomposites via incorporating in-situ fabricated hetero-structured SiC-BNNS fillers Y Han, X Shi, X Yang, Y Guo, J Zhang, J Kong, J Gu Composites Science and Technology 187, 107944, 2020 | 228 | 2020 |
| Significant improvement of thermal conductivities for BNNS/PVA composite films via electrospinning followed by hot-pressing technology X Yang, Y Guo, Y Han, Y Li, T Ma, M Chen, J Kong, J Zhu, J Gu Composites Part B: Engineering 175, 107070, 2019 | 221 | 2019 |
| Synergistic improvement of thermal conductivities of polyphenylene sulfide composites filled with boron nitride hybrid fillers J Gu, Y Guo, X Yang, C Liang, W Geng, L Tang, N Li, Q Zhang Composites Part A: Applied Science and Manufacturing 95, 267-273, 2017 | 191 | 2017 |
| Improvement of thermal conductivities for PPS dielectric nanocomposites via incorporating NH2-POSS functionalized nBN fillers X Yang, L Tang, Y Guo, C Liang, Q Zhang, K Kou, J Gu Composites Part A: Applied Science and Manufacturing 101, 237-242, 2017 | 164 | 2017 |
| Intrinsic high thermal conductive liquid crystal epoxy film simultaneously combining with excellent intrinsic self-healing performance X Yang, X Zhong, J Zhang, J Gu Journal of Materials Science & Technology 68, 209-215, 2021 | 158 | 2021 |
| Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging R Li, X Yang, J Li, Y Shen, L Zhang, R Lu, C Wang, X Zheng, H Chen, ... Materials today physics 22, 100594, 2022 | 156 | 2022 |
| High-efficiency improvement of thermal conductivities for epoxy composites from synthesized liquid crystal epoxy followed by doping BN fillers X Yang, J Zhu, D Yang, J Zhang, Y Guo, X Zhong, J Kong, J Gu Composites Part B: Engineering 185, 107784, 2020 | 155 | 2020 |
| Constructing fully carbon-based fillers with a hierarchical structure to fabricate highly thermally conductive polyimide nanocomposites Y Guo, K Ruan, X Yang, T Ma, J Kong, N Wu, J Zhang, J Gu, Z Guo Journal of Materials Chemistry C 7 (23), 7035-7044, 2019 | 142 | 2019 |
| Simultaneous improvement of thermal conductivities and electromagnetic interference shielding performances in polystyrene composites via constructing interconnection oriented … Y Guo, L Pan, X Yang, K Ruan, Y Han, J Kong, J Gu Composites Part A: Applied Science and Manufacturing 124, 105484, 2019 | 119 | 2019 |
