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Mohamed M. Sabry Aly
Mohamed M. Sabry Aly
在 ntu.edu.sg 的电子邮件经过验证
标题
引用次数
引用次数
年份
Energy-efficient abundant-data computing: The N3XT 1,000 x
MMS Aly, M Gao, G Hills, CS Lee, G Pitner, MM Shulaker, TF Wu, ...
Computer 48 (12), 24-33, 2015
2822015
Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition
H Li, TF Wu, A Rahimi, KS Li, M Rusch, CH Lin, JL Hsu, MM Sabry, ...
2016 IEEE International Electron Devices Meeting (IEDM), 16.1. 1-16.1. 4, 2016
1422016
The N3XT approach to energy-efficient abundant-data computing
MMS Aly, TF Wu, A Bartolo, YH Malviya, W Hwang, G Hills, I Markov, ...
Proceedings of the IEEE 107 (1), 19-48, 2018
1302018
Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures
MM Sabry, AK Coskun, D Atienza, TŠ Rosing, T Brunschwiler
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011
822011
Monolithic 3D integration: A path from concept to reality
MM Shulaker, TF Wu, MM Sabry, H Wei, HSP Wong, S Mitra
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015
812015
Resistive RAM endurance: Array-level characterization and correction techniques targeting deep learning applications
A Grossi, E Vianello, MM Sabry, M Barlas, L Grenouillet, J Coignus, ...
IEEE Transactions on Electron Devices 66 (3), 1281-1288, 2019
662019
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
522013
Opq: Compressing deep neural networks with one-shot pruning-quantization
P Hu, X Peng, H Zhu, MMS Aly, J Lin
Proceedings of the AAAI Conference on Artificial Intelligence 35 (9), 7780-7788, 2021
462021
Global fan speed control considering non-ideal temperature measurements in enterprise servers
J Kim, MM Sabry, D Atienza, K Vaidyanathan, K Gross
2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2014
412014
14.3 A 43pJ/cycle non-volatile microcontroller with 4.7 μs shutdown/wake-up integrating 2.3-bit/cell resistive RAM and resilience techniques
TF Wu, BQ Le, R Radway, A Bartolo, W Hwang, S Jeong, H Li, P Tandon, ...
2019 IEEE International Solid-State Circuits Conference-(ISSCC), 226-228, 2019
37*2019
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
MM Sabry, A Sridhar, D Atienza, Y Temiz, Y Leblebici, S Szczukiewicz, ...
2011 Design, Automation & Test in Europe, 1-6, 2011
362011
Application of resistive random access memory in hardware security: A review
G Rajendran, W Banerjee, A Chattopadhyay, MMS Aly
Advanced Electronic Materials 7 (12), 2100536, 2021
332021
Hardware-aware softmax approximation for deep neural networks
X Geng, J Lin, B Zhao, A Kong, MMS Aly, V Chandrasekhar
Computer Vision–ACCV 2018: 14th Asian Conference on Computer Vision, Perth …, 2019
332019
Maxpoolnms: getting rid of nms bottlenecks in two-stage object detectors
L Cai, B Zhao, Z Wang, J Lin, CS Foo, MS Aly, V Chandrasekhar
Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern …, 2019
322019
Super-resolution and sparse view CT reconstruction
G Zang, M Aly, R Idoughi, P Wonka, W Heidrich
Proceedings of the European Conference on Computer Vision (ECCV), 137-153, 2018
302018
Hierarchical thermal management policy for high-performance 3D systems with liquid cooling
F Zanini, MM Sabry, D Atienza, G De Micheli
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1 (2 …, 2011
292011
Monolithic 3D integration advances and challenges: From technology to system levels
MS Ebrahimi, G Hills, MM Sabry, MM Shulaker, H Wei, TF Wu, S Mitra, ...
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S …, 2014
282014
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
MM Sabry, AK Coskun, D Atienza
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 642-648, 2010
252010
Attaining single-chip, high-performance computing through 3D systems with active cooling
A Coskun, D Atienza, M Sabry, J Meng
IEEE Micro 31 (4), 63-75, 2011
242011
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
MM Sabry, A Sridhar, D Atienza
2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 599-604, 2012
232012
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