| A calorimetric study of precipitation in commercial aluminium alloy 6061 I Dutta, SM Allen Journal of materials science letters 10 (6), 323-326, 1991 | 489 | 1991 |
| Effect of reinforcement on the aging response of cast 6061 Al-Al2O3 particulate composites I Dutta, SM Allen, JL Hafley Metallurgical Transactions A 22, 2553-2563, 1991 | 223 | 1991 |
| A theoretical and experimental study of aluminum alloy 6061-SiC metal matrix composite to identify the operative mechanism for accelerated aging I Dutta, DL Bourell Materials Science and Engineering: A 112, 67-77, 1989 | 185 | 1989 |
| A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report I Dutta Journal of Electronic Materials 32, 201-207, 2003 | 165 | 2003 |
| Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders I Dutta, D Pan, RA Marks, SG Jadhav Materials Science and Engineering: A 410, 48-52, 2005 | 162 | 2005 |
| Influence of dislocation density and distribution on the aging behavior of 6061 AlSiCw composites I Dutta, DL Bourell Acta Metallurgica et Materialia 38 (11), 2041-2049, 1990 | 149 | 1990 |
| Impression creep characterization of rapidly cooled Sn–3.5 Ag solders I Dutta, C Park, S Choi Materials Science and Engineering: A 379 (1-2), 401-410, 2004 | 136 | 2004 |
| Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan Jom 61, 29-38, 2009 | 119 | 2009 |
| Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV) P Kumar, I Dutta, MS Bakir Journal of electronic materials 41, 322-335, 2012 | 113 | 2012 |
| Role of Al2O3 particulate reinforcements on precipitation in 2014 Al-matrix composites I Dutta, CP Harper, G Dutta Metallurgical and Materials transactions A 25, 1591-1602, 1994 | 106 | 1994 |
| An analytical study of residual stress effects on uniaxial deformation of whisker reinforced metal-matrix composites I Dutta, JD Sims, DM Seigenthaler Acta metallurgica et materialia 41 (3), 885-908, 1993 | 81 | 1993 |
| Role of interfacial and matrix creep during thermal cycling of continuous fiber reinforced metal–matrix composites I Dutta Acta materialia 48 (5), 1055-1074, 2000 | 71 | 2000 |
| A theoretical investigation of accelerated aging in metal-matrix composites I Dutta, DL Bourell, D Latimer Journal of Composite Materials 22 (9), 829-849, 1988 | 64 | 1988 |
| Creep behavior of interfaces in fiber reinforced metal–matrix composites JV Funn, I Dutta Acta materialia 47 (1), 149-164, 1998 | 61 | 1998 |
| Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load B Ye, BS Majumdar, I Dutta Acta Materialia 57 (8), 2403-2417, 2009 | 60 | 2009 |
| Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011 | 59 | 2011 |
| Underfill constraint effects during thermomechanical cycling of flip-chip solder joints I Dutta, A Gopinath, C Marshall Journal of Electronic Materials 31, 253-264, 2002 | 59 | 2002 |
| Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders T Chen, I Dutta Journal of electronic materials 37, 347-354, 2008 | 56 | 2008 |
| Deformation behavior of Sn-3.8 Ag-0.7 Cu solder at intermediate strain rates: Effect of microstructure and test conditions X Long, I Dutta, V Sarihan, DR Frear Journal of Electronic Materials 37, 189-200, 2008 | 55 | 2008 |
| Kinetic evidence for the structural similarity between a supercooled liquid and an icosahedral phase in Zr65Al7. 5Ni10Cu12. 5Ag5 bulk metallic glass MW Chen, I Dutta, T Zhang, A Inoue, T Sakurai Applied Physics Letters 79 (1), 42-44, 2001 | 54 | 2001 |
