A review on harmonic mitigation method for non-linear load in electrical power system MHA Aziz, MM Azizan, Z Sauli, MW Yahya AIP Conference Proceedings 2339 (1), 2021 | 31 | 2021 |
Underwater detection by using ultrasonic sensor SAA Bakar, NR Ong, MHA Aziz, JB Alcain, W Haimi, Z Sauli AIP Conference Proceedings 1885 (1), 2017 | 19 | 2017 |
Shear stress analysis study using surface morphology correlation with aluminium ball adhesion V Retnasamy, Z Sauli, MHA Aziz, RM Hatta, AHM Shapri, S Taniselass 2012 Fourth International Conference on Computational Intelligence …, 2012 | 13 | 2012 |
Polymer core BGA stress analysis at minimal vertical loading Z Sauli, V Retnasamy, S Taniselass, NAZ Rahman, MHA Aziz Advanced Materials Research 622, 639-642, 2013 | 8 | 2013 |
Stress analysis on through holes in PCB Z Sauli, V Retnasamy, K Vengdasalam, MHA Aziz, RM Hatta, R Vairavan 2012 Fourth International Conference on Computational Intelligence …, 2012 | 7 | 2012 |
16× 16 fast signed multiplier using Booth and Vedic architecture LZ Shing, R Hussin, A Kamarudin, SN Mohyar, S Taking, MHA Aziz, ... AIP Conference Proceedings 2045 (1), 2018 | 6 | 2018 |
Contact angle analysis on glass based surface MHAB Aziz, Z Sauli, V Retnasamy, WM Wan Norhaimi, S Taniselass, ... Applied Mechanics and Materials 680, 93-96, 2014 | 5 | 2014 |
Polymer core BGA vertical stress loading analysis Z Sauli, V Retnasamy, S Taniselass, AHM Shapri, RM Hatta, MHA Aziz 2012 Fourth International Conference on Computational Intelligence …, 2012 | 5 | 2012 |
Variation in heat sink shape for thermal analysis CM Wong, M Aziz, NR Ong, JB Alcain, Z Sauli AIP Conference Proceedings 1885 (1), 2017 | 4 | 2017 |
Modelling of cantilever based on piezoelectric energy harvester NF Rahim, NR Ong, MHA Aziz, JB Alcain, W Haimi, Z Sauli AIP Conference Proceedings 1885 (1), 2017 | 4 | 2017 |
A comparative study of thermal performance on commercialized LED bulb on the luminaire geometry LS Leng, V Retnasamy, MM Shahimin, Z Sauli, S Taniselass, ... Light-Emitting Diodes: Materials, Devices, and Applications for Solid State …, 2017 | 3 | 2017 |
Breast surface coordinate variation analysis caused by round shape tumor with fringe projection profilometry WMW Norhaimi, R Vairavan, Z Sauli, V Retnasamy, MHA Aziz, H Aris, ... Smart Biomedical and Physiological Sensor Technology XV 10662, 137-144, 2018 | 2 | 2018 |
Ceramic ball grid array package stress analysis S Badri, MHA Aziz, NR Ong, Z Sauli, JB Alcain, V Retnasamy AIP Conference Proceedings 1885 (1), 2017 | 2 | 2017 |
PCBA depaneling stress minimization study M Darus, M Aziz, NR Ong, JB Alcain, V Retnasamy AIP Conference Proceedings 1885 (1), 2017 | 2 | 2017 |
Validation of thermal effects of LED package by using Elmer finite element simulation method LS Leng, V Retnasamy, MM Shahimin, Z Sauli, S Taniselass, ... Light-emitting diodes: materials, devices, and applications for solid state …, 2017 | 2 | 2017 |
Grain Size Analysis on Ba0.65Sr0.35TiO3 Thin Films Using Design of Experiment V Retnasamy, Z Sauli, R Vairavan, S Taniselass, MH Ab Aziz, P Ehkan, ... Advanced Materials Research 896, 211-214, 2014 | 2 | 2014 |
Relationship between Controllable Process Parameters on Bump Height in ENIG Z Sauli, V Retnasamy, FAA Fuad, P Ehkan, MH Ab Aziz Applied Mechanics and Materials 404, 62-66, 2013 | 2 | 2013 |
Microfluidic channel depth determination with Tywman–Green interferometer W Haimi, Z Sauli, V Retnasamy, S Taniselas, N Ramli, MHA Aziz, R Hatta The International Journal of Advanced Manufacturing Technology 67, 851-855, 2013 | 2 | 2013 |
Effect of copper FAB impact on palladium bond pad Z Sauli, V Retnasamy, S Taniselass, WMW Norhaimi, MHA Aziz, ... 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012 | 2 | 2012 |
The role of Reactive Ion Etching (RIE) on wirebond formation: A study on successful rate of thermosonic gold wire on aluminium bondpad Z Sauli, V Retnasamy, NAZ Rahman, MHA Aziz, HA Razak, ... 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012 | 2 | 2012 |