| Application of machine learning for optimization of 3-D integrated circuits and systems SJ Park, B Bae, J Kim, M Swaminathan IEEE transactions on very large scale integration (VLSI) systems 25 (6 …, 2017 | 75 | 2017 |
| Analytical expressions for maximum transferred power in wireless power transfer systems S Kong, M Kim, K Koo, S Ahn, B Bae, J Kim 2011 IEEE International Symposium on Electromagnetic Compatibility, 379-383, 2011 | 72 | 2011 |
| An investigation of electromagnetic radiated emission and interference from multi-coil wireless power transfer systems using resonant magnetic field coupling S Kong, B Bae, DH Jung, JJ Kim, S Kim, C Song, J Kim, J Kim IEEE Transactions on Microwave Theory and Techniques 63 (3), 833-846, 2015 | 59 | 2015 |
| High-efficiency PCB-and package-level wireless power transfer interconnection scheme using magnetic field resonance coupling S Kim, DH Jung, JJ Kim, B Bae, S Kong, S Ahn, J Kim, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 37 | 2015 |
| 30 Gbps high-speed characterization and channel performance of coaxial through silicon via DH Jung, H Kim, S Kim, JJ Kim, B Bae, J Kim, JM Yook, JC Kim, J Kim IEEE Microwave and Wireless Components Letters 24 (11), 814-816, 2014 | 36 | 2014 |
| Modeling and measurement of power supply noise effects on an analog-to-digital converter based on a chip-PCB hierarchical power distribution network analysis B Bae, Y Shim, K Koo, J Cho, JS Pak, J Kim IEEE transactions on electromagnetic compatibility 55 (6), 1260-1270, 2013 | 31 | 2013 |
| MoM-based ground current reconstruction in RFI application Q Huang, L Li, X Yan, B Bae, H Park, C Hwang, J Fan IEEE Transactions on Electromagnetic Compatibility 60 (4), 1121-1128, 2018 | 27 | 2018 |
| MoM based current reconstruction using near-field scanning Q Huang, L Li, X Yan, B Bae, H Park, C Hwang, J Fan 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 27 | 2017 |
| Extracting characteristic impedance of a transmission line referenced to a meshed ground plane J He, C Hwang, J Pan, GY Cho, B Bae, HB Park, J Fan 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 21 | 2016 |
| Electromagnetic radiated emissions from a repeating-coil wireless power transfer system using a resonant magnetic field coupling S Kong, B Bae, JJ Kim, S Kim, DH Jung, J Kim 2014 IEEE Wireless Power Transfer Conference, 138-141, 2014 | 18 | 2014 |
| Design, implementation and measurement of board-to-board wireless power transfer (WPT) for low voltage applications S Kim, B Bae, S Kong, DH Jung, JJ Kim, J Kim 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013 | 18 | 2013 |
| Flexible flat cable comprising stacked insulating layers covered by a conductive outer skin and method for manufacturing B Bae, YK Kwon US Patent 10,651,526, 2020 | 16 | 2020 |
| Electromagnetic interference shielding effects in wireless power transfer using magnetic resonance coupling for board-to-board level interconnection S Kim, H Kim, JJ Kim, B Bae, S Kong, J Kim 2013 IEEE International Symposium on Electromagnetic Compatibility, 773-778, 2013 | 16 | 2013 |
| A novel stochastic model-based eye-diagram estimation method for 8B/10B and TMDS-encoded high-speed channels J Park, S Choi, JJ Kim, Y Kim, M Lee, H Kim, B Bae, H Song, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 60 (5), 1510-1519, 2017 | 14 | 2017 |
| SNR analysis and optimization in near-field scanning and EMI applications G Maghlakelidze, X Yan, L Guan, S Marathe, Q Huang, B Bae, C Hwang, ... IEEE Transactions on Electromagnetic Compatibility 60 (4), 1087-1094, 2018 | 12 | 2018 |
| High-frequency modeling and signal integrity analysis of a silicone rubber socket for high-performance package H Kim, JJ Kim, J Park, S Park, S Choi, B Bae, DH Ha, M Bae, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 12 | 2017 |
| Noise coupling effects on CMOS analog-to-digital converter in magnetic field wireless power transfer system using chip-PCB comodeling and simulation B Bae, JJ Kim, S Kim, S Kong, J Kim IEEE Transactions on Electromagnetic Compatibility 57 (3), 329-338, 2015 | 12 | 2015 |
| Application of VSI‐EBG structure to high‐speed differential signals for wideband suppression of common‐mode noise M Kim, S Kim, B Bae, J Cho, J Kim, J Kim, DS Ahn ETRI Journal 35 (5), 827-837, 2013 | 12 | 2013 |
| Through-silicon via capacitance–voltage hysteresis modeling for 2.5-D and 3-D IC DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 11 | 2017 |
| Non-contact wafer-level TSV connectivity test methodology using magnetic coupling JJ Kim, H Kim, S Kim, B Bae, DH Jung, S Kong, J Kim, J Lee, K Park 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2013 | 11 | 2013 |
Joungho KimProfessor of Electrical Engineering KAIST在 kaist.ac.kr 的电子邮件经过验证
