Investigations of the influence of dicing techniques on the strength properties of thin silicon S Schoenfelder, M Ebert, C Landesberger, K Bock, J Bagdahn Microelectronics reliability 47 (2-3), 168-178, 2007 | 114 | 2007 |
Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon V Ganapati, S Schoenfelder, S Castellanos, S Oener, R Koepge, ... Journal of Applied Physics 108 (6), 2010 | 77 | 2010 |
Modeling and testing the mechanical strength of solar cells F Kaule, W Wang, S Schoenfelder Solar energy materials and solar cells 120, 441-447, 2014 | 72 | 2014 |
Microcracks in silicon wafers I: Inline detection and implications of crack morphology on wafer strength M Demant, T Welschehold, M Oswald, S Bartsch, T Brox, S Schoenfelder, ... IEEE Journal of Photovoltaics 6 (1), 126-135, 2015 | 59 | 2015 |
High quality half-cell processing using thermal laser separation S Eiternick, F Kaule, HU Zühlke, T Kießling, M Grimm, S Schoenfelder, ... Energy Procedia 77, 340-345, 2015 | 49 | 2015 |
Detection and analysis of micro-cracks in multi-crystalline silicon wafers during solar cell production M Demant, S Rein, J Krisch, S Schoenfelder, C Fischer, S Bartsch, R Preu 2011 37th IEEE Photovoltaic Specialists Conference, 001641-001646, 2011 | 43 | 2011 |
Loss of wire tension in the wire web during the slurry based multi wire sawing process D Meißner, S Schoenfelder, B Hurka, J Zeh, K Sunder, R Koepge, ... Solar energy materials and solar cells 120, 346-355, 2014 | 41 | 2014 |
Mechanical damage of half-cell cutting technologies in solar cells and module laminates F Kaule, M Pander, M Turek, M Grimm, E Hofmueller, S Schoenfelder AIP Conference Proceedings 1999 (1), 2018 | 38 | 2018 |
Solar module with half size solar cells J Schneider, S Schoenfelder, S Dietrich, M Turek 29th EUPVSEC, Amsterdam, 185, 2014 | 36 | 2014 |
Comparison of test methods for strength characterization of thin solar wafer S Schoenfelder, A Bohne, J Bagdahn Proceedings of the 22nd European Photovoltaic Solar Energy Conference 1 …, 2007 | 36 | 2007 |
Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon F Wallburg, M Kuna, M Budnitzki, S Schoenfelder Wear 454, 203328, 2020 | 29 | 2020 |
Micro-cracks in silicon wafers and solar cells: detection and rating of mechanical strength and electrical quality M Demant, M Oswald, T Welschehold, S Nold, S Bartsch, S Schoenfelder, ... Proceedings of the 29th Solar Energy Conference and Exhibition, 390-396, 2014 | 21 | 2014 |
Mechanical characterisation and modelling of thin chips S Schoenfelder, J Bagdahn, M Petzold Ultra-Thin Chip Technology and Applications, 195-218, 2011 | 21 | 2011 |
Evaluation of silicon solar cell separation techniques for advanced module concepts M Oswald, M Turek, J Schneider, S Schoenfelder 28th EUPVSEC 29, 2013 | 18 | 2013 |
The influence of transport operations on the wafer strength and breakage rate R Koepge, S Schoenfelder, T Giesen, C Fischmann, A Verl, J Bagdahn | 18 | 2011 |
Investigations of strength properties of ultra-thin silicon S Schonfelder, J Bagdahn, M Ebert, M Petzold, K Bock, C Landesberger EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005 | 17 | 2005 |
A material removal coefficient for diamond wire sawing of silicon F Wallburg, M Kuna, M Budnitzki, S Schoenfelder Wear 504, 204400, 2022 | 16 | 2022 |
A novel parameter for the prediction of pedicle screw fixation in cancellous bone-A biomechanical study on synthetic foam M Weidling, C Oefner, S Schoenfelder, CE Heyde Medical Engineering & Physics 79, 44-51, 2020 | 16 | 2020 |
Analysis of photoelastic properties of monocrystalline silicon M Stoehr, G Gerlach, T Härtling, S Schoenfelder Journal of Sensors and Sensor Systems 9 (2), 209-217, 2020 | 15 | 2020 |
Laser-assisted spalling of large-area semiconductor and solid state substrates F Kaule, M Swoboda, C Beyer, R Rieske, A Ajaj, WD Drescher, ... MRS Communications 8 (1), 127-131, 2018 | 14 | 2018 |