| Electrostatic compensation of structural imperfections in dynamically amplified dual-mass gyroscope E Alexandra, L Yu-Wei, W Danmeng, S Andrei M. 2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2017 | 40* | 2017 |
| Dual foucault pendulum gyroscope D Senkal, A Efimovskaya, AM Shkel 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 23 | 2015 |
| Origami-like 3-D folded MEMS approach for miniature inertial measurement unit A Efimovskaya, YW Lin, AM Shkel Journal of Microelectromechanical Systems 26 (5), 1030-1039, 2017 | 22 | 2017 |
| Minimal realization of dynamically balanced lumped mass WA gyroscope: Dual foucault pendulum D Senkal, A Efimovskaya, AM Shkel 2015 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2015 | 22 | 2015 |
| On ordering of fundamental wineglass modes in toroidal ring gyroscope A Efimovskaya, D Wang, YW Lin, AM Shkel 2016 IEEE SENSORS, 1-3, 2016 | 15 | 2016 |
| Compact roll-pitch-yaw gyroscope implemented in wafer-level epitaxial silicon encapsulation process A Efimovskaya, Y Yang, E Ng, Y Chen, I Flader, TW Kenny, AM Shkel 2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017 | 13 | 2017 |
| A comparative study of conventional single-mass and amplitude amplified dual-mass MEMS vibratory gyroscopes D Wang, MH Asadian, A Efimovskaya, AM Shkel 2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017 | 13 | 2017 |
| Mechanical trimming with focused ion beam for permanent tuning of MEMS dual-mass gyroscope A Efimovskaya, D Wang, AM Shkel Sensors and Actuators A: Physical 313, 112189, 2020 | 11 | 2020 |
| Miniature origami-like folded MEMS TIMU A Efimovskaya, D Senkal, AM Shkel 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 11 | 2015 |
| Amplitude amplified dual-mass gyroscope: Design architecture and noise mitigation strategies D Wang, A Efimovskaya, AM Shkel 2019 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2019 | 9 | 2019 |
| Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration A Efimovskaya, D Senkal, S Askari, AM Shkel 2015 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2015 | 9 | 2015 |
| 160 milli-ohm electrical resistance thru-wafer interconnects with 10: 1 Aspect ratio A Efimovskaya, AM Shkel International Symposium on Microelectronics 2014 (1), 000505-000510, 2014 | 7 | 2014 |
| Multi-degree-of-freedom MEMS coriolis vibratory gyroscopes designed for dynamic range, robustness, and sensitivity A Efimovskaya, AM Shkel 2018 DGON Inertial Sensors and Systems (ISS), 1-17, 2018 | 6 | 2018 |
| Study of environmental survivability and stability of folded MEMS IMU YW Lin, A Efimovskaya, AM Shkel 2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017 | 4 | 2017 |
| On cross-talk between gyroscopes integrated on a folded MEMS IMU Cube A Efimovskaya, YW Lin, Y Yang, E Ng, Y Chen, I Flader, CH Ahn, V Hong, ... 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017 | 4 | 2017 |
| O vliyanii nelineynykh faktorov na dinamiku mikromekhanicheskogo giroskopa s dvukhmassovym chuvstvitel’nym elementom [On the influence of nonlinear factors on the dynamics of … AM Lestev, AV Efimovskaya Izvestiya vysshikh uchebnykh zavedeniy. Priborostroenie–Journal of …, 2012 | 4 | 2012 |
| Double-sided process for MEMS SOI sensors with deep vertical thru-wafer interconnects A Efimovskaya, YW Lin, AM Shkel Journal of Microelectromechanical Systems 27 (2), 239-249, 2018 | 3 | 2018 |
| Thru-wafer interconnects for double-sided (TWIDS) fabrication of MEMS A Efimovskaya, YW Lin, AM Shkel 2016 IEEE International Symposium on Inertial Sensors and Systems, 66-69, 2016 | 3 | 2016 |
| Folded MEMS platform based on polymeric flexible hinges for 3D integration of spatially-distributed sensors YW Lin, A Efimovskaya, AM Shkel Journal of Microelectromechanical Systems 30 (6), 907-914, 2021 | 2 | 2021 |
| Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS) AA Shkel, A Efimovskaya US Patent 9,611,138, 2017 | 2 | 2017 |
