| Mechanical mapping of the interphase in carbon fiber reinforced poly (ether-ether-ketone) composites using peak force atomic force microscopy: Interphase shrinkage under … YF Niu, Y Yang, S Gao, JW Yao Polymer Testing 55, 257-260, 2016 | 57 | 2016 |
| Investigation of the interphase structures and properties of carbon fiber reinforced polymer composites exposed to hydrothermal treatments using peak force quantitative … YF Niu, Y Yang, XR Wang Polymer Composites 39 (S2), E791-E796, 2018 | 38 | 2018 |
| Sensitivity of nanoindentation strain rate in poly (ester-ester-ketone) using atomic force microscopy Y Yang Polymer Testing 53, 85-88, 2016 | 17 | 2016 |
| Effects of UV irradiation and condensation on poly (ether-ether-ketone)/carbon fiber composites from nano-to macro-scale YF Niu, Y Yang, TY Li, JW Yao High Performance Polymers 30 (2), 230-238, 2018 | 14 | 2018 |
| Using confocal microscopy and digital image correlation to measure local strains around a chip corner and a crack front Y Yang, PM Souare, J Sylvestre IEEE Transactions on Device and Materials Reliability 20 (1), 97-105, 2019 | 10 | 2019 |
| Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 132, 114533, 2022 | 6 | 2022 |
| Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 128, 114431, 2022 | 6 | 2022 |
| A mechanistic study of underfill cracks by the Confocal-DIC method Y Yang, F Habib, PM Souare, E Duchesne, J Sylvestre 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1087-1093, 2020 | 5 | 2020 |
| Direct measurements of underfill local strain using confocal microscopy and digital image correlation Y Yang, PM Souare, J Sylvestre 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 4 | 2019 |
Papa Momar SouareIBM Bromont在 ibm.com 的电子邮件经过验证
Papa Momar SouareIBM Bromont在 ibm.com 的电子邮件经过验证
Julien SylvestreUniversité de Sherbrooke在 usherbrooke.ca 的电子邮件经过验证