| Flexible thin-film acoustic wave devices with off-axis bending characteristics for multisensing applications Z Ji, J Zhou, H Lin, J Wu, D Zhang, S Garner, A Gu, S Dong, YQ Fu, ... Microsystems & Nanoengineering 7 (1), 97, 2021 | 34 | 2021 |
| Deep SiO2 etching with Al and AlN masks for MEMS devices V Bliznetsov, HM Lin, YJ Zhang, D Johnson Journal of Micromechanics and Microengineering 25 (8), 087002, 2015 | 31 | 2015 |
| Investigation of flow distribution in microchannels heat sinks D Bogojevic, K Sefiane, AJ Walton, JRE Christy, G Cummins, H Lin Heat Transfer Engineering 30 (13), 1049-1057, 2009 | 26 | 2009 |
| Direct Al–Al contact using low temperature wafer bonding for integrating MEMS and CMOS devices H Lin, JTM Stevenson, AM Gundlach, CC Dunare, AJ Walton Microelectronic engineering 85 (5-6), 1059-1061, 2008 | 22 | 2008 |
| A low temperature drifting acoustic wave pressure sensor with an integrated vacuum cavity for absolute pressure sensing T Wang, Z Tang, H Lin, K Zhan, J Wan, S Wu, Y Gu, W Luo, W Zhang Sensors 20 (6), 1788, 2020 | 16 | 2020 |
| Thin-film magnetic inductor for integrated power management AA Muthukumaraswamy, KJ Chui, WY Lim, J Yu, S Soh, LY Wing, H Lin, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1485-1490, 2017 | 16 | 2017 |
| An evaluation of test structures for measuring the contact resistance of 3-D bonded interconnects H Lin, S Smith, JTM Stevenson, AM Gundlach, CC Dunare, AJ Walton 2008 IEEE International Conference on Microelectronic Test Structures, 123-127, 2008 | 14 | 2008 |
| Test structures for the characterization of MEMS and CMOS integration technology H Lin, AJ Walton, CC Dunare, JTM Stevenson, AM Gundlach, S Smith, ... IEEE transactions on semiconductor manufacturing 21 (2), 140-147, 2008 | 11 | 2008 |
| MEMS Industry-Worth Etching to Fabricate Tapered Structures in SiO2 V Bliznetsov, B Li, JW Lee, H Lin Journal of Microelectromechanical Systems 26 (6), 1400-1407, 2017 | 9 | 2017 |
| Oxide overlayer formation on sputtered ScAlN film exposed to air M Li, H Lin, K Hu, Y Zhu Applied Physics Letters 121 (11), 2022 | 8 | 2022 |
| The electrical and optical properties of the nonlinear optical polymer DR1/PMMA films H Zhang, Z Xia, S Zhou, H Ding, Y Cao, H Lin, J Zhu 9th International Symposium on Electrets (ISE 9) Proceedings, 462-467, 1996 | 8 | 1996 |
| Structural characterization of the abnormal grains evolution in sputtered ScAlN films M Li, K Hu, H Lin, Y Zhu 2021 IEEE International Ultrasonics Symposium (IUS), 1-3, 2021 | 7 | 2021 |
| Integrated magnetic inductor technology on silicon S Raju, S Soh, LY Wing, D Ho, L Huamao, M Stenger-Koob, J Wrona, ... 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 262-265, 2018 | 7 | 2018 |
| Bonding method using porosified surfaces for making stacked structures RK Kotlanka, R Kumar, PC SANKARAPILLAI, LIN Huamao, P Yelehanka US Patent 8,940,616, 2015 | 6 | 2015 |
| Oxidation of sputtered AlScN films exposed to the atmosphere M Li, K Hu, H Lin, V Felmetsger, Y Zhu 2022 IEEE International Ultrasonics Symposium (IUS), 1-3, 2022 | 5 | 2022 |
| Texture evolution of ferroelectric AlScN films on metal under-layers M Li, H Lin, P Luo, K Hu, C Liu, L Chen, Y Zhu 2022 IEEE International Symposium on Applications of Ferroelectrics (ISAF), 1-3, 2022 | 4 | 2022 |
| Silicon-post processing CMOS wafers to create integrated sensors, MEMS and electro-optic systems AJ Walton, JTM Stevenson, I Underwood, JG Terry, S Smith, W Parkes, ... SAIEE Africa Research Journal 101 (1), 3-10, 2010 | 4 | 2010 |
| Application of CMP for Integrating MEMS and CMOS Technology H Lin, JTM Stevenson, AM Gundlach, CC Dunare, AJ Walton 16th MME-MicroMechanics Europe Workshop, 4, 2005 | 4 | 2005 |
| The charge dynamics of thermally wet grown SiO/sub 2/electret by corona charging method with constant grid current L Huamao, X Zhongfu, S Shaoqun, Z Hongyan, C Yang, Z Jianwei 9th International Symposium on Electrets (ISE 9) Proceedings, 133-138, 1996 | 4 | 1996 |
| Ultrathin Pt and Mo films on Al1–xScxN: an interface investigation Y Ding, X Hou, T Jin, Y Wang, X Lian, Y Liu, Y Wang, S Duan, X Geng, ... Applied Surface Science 637, 157921, 2023 | 3 | 2023 |
