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Vishnu Raj Shukla
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Microarchitected 3D printed polylactic acid (PLA) nanocomposite scaffolds for biomedical applications
F Alam, VR Shukla, KM Varadarajan, S Kumar
Journal of the Mechanical Behavior of Biomedical Materials 103, 103576, 2020
1422020
Domination of volumetric toughening by silver nanoparticles over interfacial strengthening of carbon nanotubes in bactericidal hydroxyapatite biocomposite
K Herkendell, VR Shukla, AK Patel, K Balani
Materials science and engineering: C 34, 455-467, 2014
372014
Multi-length scale wear damage mechanisms of ultra-high molecular weight polyethylene nanocomposites
F Alam, A Kumar, VR Shukla, A Nisar, K Balani
Polymer Testing 81, 106210, 2020
62020
Application of machine learning in recognition and analysis of TSV extrusion profiles with multiple morphology
G Jalilvand, J Lindsay, B Reidy, V Shukla, D Duggan, R Zand, T Jiang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1652-1659, 2021
42021
Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys
V Shukla, O Ahmed, G Jalilvand, A Mehta, P Su, T Jiang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 667-672, 2021
22021
Simulation-Assisted Board Level Solder Joint Reliability Optimization for Large 80mm+ 2.5 D Devices
O Ahmed, V Shukla, L Hutchinson, P Su, B Glasauer, T Jiang
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1303-1308, 2023
12023
The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys
V Shukla, N Ayers, A Moreno, N Crutchfield, D Lyons, O Ahmed, P Su, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1687-1694, 2022
12022
Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications
V Shukla, O Ahmed, P Su, T Tian, T Jiang
Metals 14 (7), 803, 2024
2024
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