Microarchitected 3D printed polylactic acid (PLA) nanocomposite scaffolds for biomedical applications F Alam, VR Shukla, KM Varadarajan, S Kumar Journal of the Mechanical Behavior of Biomedical Materials 103, 103576, 2020 | 142 | 2020 |
Domination of volumetric toughening by silver nanoparticles over interfacial strengthening of carbon nanotubes in bactericidal hydroxyapatite biocomposite K Herkendell, VR Shukla, AK Patel, K Balani Materials science and engineering: C 34, 455-467, 2014 | 37 | 2014 |
Multi-length scale wear damage mechanisms of ultra-high molecular weight polyethylene nanocomposites F Alam, A Kumar, VR Shukla, A Nisar, K Balani Polymer Testing 81, 106210, 2020 | 6 | 2020 |
Application of machine learning in recognition and analysis of TSV extrusion profiles with multiple morphology G Jalilvand, J Lindsay, B Reidy, V Shukla, D Duggan, R Zand, T Jiang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1652-1659, 2021 | 4 | 2021 |
Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys V Shukla, O Ahmed, G Jalilvand, A Mehta, P Su, T Jiang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 667-672, 2021 | 2 | 2021 |
Simulation-Assisted Board Level Solder Joint Reliability Optimization for Large 80mm+ 2.5 D Devices O Ahmed, V Shukla, L Hutchinson, P Su, B Glasauer, T Jiang 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1303-1308, 2023 | 1 | 2023 |
The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys V Shukla, N Ayers, A Moreno, N Crutchfield, D Lyons, O Ahmed, P Su, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1687-1694, 2022 | 1 | 2022 |
Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications V Shukla, O Ahmed, P Su, T Tian, T Jiang Metals 14 (7), 803, 2024 | | 2024 |