| Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests CJ Lee, KD Min, HJ Park, SB Jung Journal of Alloys and Compounds 820, 153077, 2020 | 37 | 2020 |
| Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages KH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB Jung Applied Surface Science 495, 143487, 2019 | 28 | 2019 |
| Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP) JH Kim, CJ Lee, KD Min, BU Hwang, DG Kang, DH Choi, J Joo, SB Jung Composite Structures 258, 113364, 2021 | 26 | 2021 |
| Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant KH Jung, KD Min, CJ Lee, SB Jung Journal of Alloys and Compounds 781, 657-663, 2019 | 23 | 2019 |
| Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding HS Joo, CJ Lee, KD Min, BU Hwang, SB Jung Journal of Materials Science: Materials in Electronics 31, 22926-22932, 2020 | 21 | 2020 |
| Hybrid transient liquid phase sintering bonding of Sn-3.0 Ag-0.5 Cu solder with added Cu and Ni for CuNi bonding KD Min, CJ Lee, BU Hwang, JH Kim, JH Jang, SB Jung Applied Surface Science 551, 149396, 2021 | 16 | 2021 |
| Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package H Jeong, KH Jung, CJ Lee, KD Min, WR Myung, SB Jung Journal of Materials Science: Materials in Electronics 31, 6835-6842, 2020 | 16 | 2020 |
| Effect of Sn-decorated MWCNTs on the mechanical reliability of Sn–58Bi solder CJ Lee, KD Min, HJ Park, JH Kim, SB Jung Electronic Materials Letters 15, 693-701, 2019 | 16 | 2019 |
| Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test H Jeong, KD Min, CJ Lee, JH Kim, SB Jung Microelectronics Reliability 112, 113918, 2020 | 15 | 2020 |
| Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior CJ Lee, DG Kang, BU Hwang, KD Min, J Joo, SB Jung Journal of Alloys and Compounds 863, 158726, 2021 | 12 | 2021 |
| Ultrafast photonic soldering with Sn–58Bi using intense pulsed light energy KH Jung, KD Min, CJ Lee, H Jeong, JH Kim, SB Jung Advanced Engineering Materials 22 (12), 2000179, 2020 | 12 | 2020 |
| The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder CJ Lee, KD Min, BU Hwang, JH Kim, SB Jung Current Applied Physics 19 (11), 1182-1186, 2019 | 9 | 2019 |
| Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability BU Hwang, KH Jung, KD Min, CJ Lee, SB Jung Journal of Materials Science: Materials in Electronics 32, 3054-3065, 2021 | 8 | 2021 |
| Microstructures and mechanical properties of the Sn58wt.% Bi composite solders with Sn decorated MWCNT particles HJ Park, CJ Lee, KD Min, SB Jung Journal of Electronic Materials 48, 1746-1753, 2019 | 8 | 2019 |
| Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung Journal of Alloys and Compounds 857, 157595, 2021 | 7 | 2021 |
| The fabrication of Ni-MWCNT composite solder and its reliability under high relative humidity and temperature CJ Lee, KD Min, H Jeong, BU Hwang, SB Jung Journal of Electronic Materials 49, 6746-6753, 2020 | 7 | 2020 |
| Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering CJ Lee, KH Jung, KD Min, BG Park, SB Jung Journal of Materials Science & Technology 53, 13-18, 2020 | 7 | 2020 |
| Thermal and thermomechanical behaviors of the fan-out package with embedded Ag patterns KH Jung, H Jeong, CJ Lee, KD Min, SB Jung IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 7 | 2020 |
| Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85° C/85% Relative Humidity Environmental Conditions KD Min, CJ Lee, HJ Park, SB Jung Journal of Electronic Materials 49, 1527-1533, 2020 | 7 | 2020 |
| Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0 Ag–0.5 Cu ball grid array package KD Min, E Ha, S Lee, JS Hwang, T Kang, J Joo, SB Jung Journal of Manufacturing Processes 98, 19-28, 2023 | 6 | 2023 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
Kwang-Ho JungSamsung Electronics在 samsung.com 的电子邮件经过验证