| Electrospun silicon carbide nanowire film: a highly thermally conductivity and flexible material for advanced thermal management Z Chen, S Gao, J Zhang, D Liu, J Zeng, Y Yao, JB Xu, R Sun Composites Communications 41, 101654, 2023 | 5 | 2023 |
| Collaborative electrospinning and ice-templating for sea urchin-inspired aerogel microsphere: Unraveling functional mechanisms in thermally conductive phase change composites J Zhang, J Zhang, D Liu, J Zeng, Z Ye, M Han, S Zhang, Y Yao, R Sun Composites Science and Technology 250, 110538, 2024 | 1 | 2024 |
| Organic Conjugated Small Molecules with High Thermal Conductivity as an Effective Coupling Layer for Heat Transfer D Liu, S Wang, J Zhang, J Zeng, M Han, Y Yao, JB Xu, X Zeng, R Sun ACS Applied Materials & Interfaces 15 (47), 54818-54828, 2023 | 1 | 2023 |
| Constructing phonon transport bridges via low-temperature sintering in Diamond@ Ag/EP composite to achieve efficient 3D networks structure Z Zheng, XX Lu, L Xu, Y Liu, J Zeng, H Zhang, J Wen, P Zhu, R Sun, ... Chemical Engineering Journal 495, 153499, 2024 | | 2024 |
| Correlating Young's Modulus with High Thermal Conductivity in Organic Conjugated Small Molecules J Zeng, T Liang, J Zhang, D Liu, S Li, X Lu, M Han, Y Yao, JB Xu, R Sun, ... Small 20 (21), 2309338, 2024 | | 2024 |
| Deformable and Highly Adhesive Poly (ionic liquid)/Liquid Metal Visco-Elastomers for Thermal Management B Yang, J Zeng, T Liang, M Han, C Zhang, J Xu, Y Yao, R Sun Journal of Materials Chemistry A, 2024 | | 2024 |
| Creating Biomimetic Central-Radial Skeletons with Efficient Mass Adsorption and Transport J Zhang, X Bai, J Zeng, D Liu, Z Ye, M Han, JB Xu, Y Yao, R Sun ACS Applied Materials & Interfaces 15 (41), 48551-48563, 2023 | | 2023 |
| High-Performance Thermal Interface Material with A Radial Filler Skeleton J Zhang, D Liu, J Zeng, X Zeng, JB Xu, Y Yao, R Sun 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Conjugated Small Molecule Crystals as A Coupling Layer Between Carbon-based Thermal Interface Materials and Heat Sink D Liu, J Zhang, J Zeng, R Sun, JB Xu, Y Yao, X Zeng 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Investigation of the main factors affecting the magnetic properties of silicon steel sheets by comparing three kinds of silicon steel J Zeng, L Li, J Gao, X Huo, Z Peng Journal of Physics: Conference Series 2390 (1), 012030, 2022 | | 2022 |
