| Plasma processing of low-k dielectrics MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ... Journal of Applied Physics 113 (4), 2013 | 358 | 2013 |
| Mechanistic study of plasma damage of low k dielectric surfaces J Bao, H Shi, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2008 | 121 | 2008 |
| Role of ions, photons, and radicals in inducing plasma damage to ultra low-k dielectrics H Shi, H Huang, J Bao, J Liu, PS Ho, Y Zhou, JT Pender, MD Armacost, ... Journal of Vacuum Science & Technology B 30 (1), 2012 | 61 | 2012 |
| Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics H Shi, J Bao, RS Smith, H Huang, J Liu, PS Ho, ML McSwiney, ... Applied Physics Letters 93 (19), 2008 | 38 | 2008 |
| Oxygen plasma damage to blanket and patterned ultralow-κ surfaces J Bao, H Shi, H Huang, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ... Journal of Vacuum Science & Technology A 28 (2), 207-215, 2010 | 31 | 2010 |
| Restoration and pore sealing of plasma damaged porous organosilicate low k dielectrics with phenyl containing agents J Liu, W Kim, J Bao, H Shi, W Baek, PS Ho Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2007 | 31 | 2007 |
| O2 plasma damage and dielectric recoveries to patterned CDO low-k dielectrics H Huang, J Bao, H Shi, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ... Advanced Metallization Conference, 2008 | 25 | 2008 |
| Mechanistic study of plasma damage and CH4 recovery of low k dielectric surface JJ Bao, HL Shi, JJ Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ... 2007 IEEE International Interconnect Technology Conferencee, 147-149, 2007 | 18 | 2007 |
| Mechanistic study of plasma damage to porous low-k: process development and dielectric recovery H Shi The University of Texas at Austin, 2010 | 14 | 2010 |
| Plasma altered layer model for plasma damage characterization of porous OSG films H Shi, H Huang, J Bao, J Im, PS Ho, Y Zhou, JT Pender, M Armacost, ... 2009 IEEE International Interconnect Technology Conference, 78-80, 2009 | 10 | 2009 |
| Moisture transport and its effects on fracture strength and dielectric constant of underfill materials KH Lu, B Chao, Z Luo, L Zhang, H Shi, J Im, PS Ho, L Li, M Ahmad 2007 Proceedings 57th Electronic Components and Technology Conference, 1040-1044, 2007 | 10 | 2007 |
| Plasma Processing of Low‐k Dielectrics H Shi, D Shamiryan, JF de Marneffe, H Huang, PS Ho, MR Baklanov Advanced Interconnects for ULSI Technology, 79-128, 2012 | 8 | 2012 |
| Advanced Interconnects for ULSI Technology H Shi, D Shamiryan, JF de Marneffe, H Huang, PS Ho, MR Baklanov John Wiley & Sons, Ltd, 2012 | 7 | 2012 |
| Minimization of plasma ashing damage to OSG low-k dielectrics H Shi, H Huang, J Im, PS Ho, Y Zhou, JT Pender, M Armacost, D Kyser 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 6 | 2010 |
| Moinpour M and Kloster GM J Bao, H Shi, H Huang, PS Ho, ML McSwiney, MD Goodner J. Vac. Sci. Technol. A 2010, 28, 2010 | 6 | 2010 |
| Effect of CH 4 Plasma Treatment on O 2 Plasma Ashed Organosilicate Low-k Dielectrics H Shi, J Bao, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ... Materials, Processes, Integration and Reliability in Advanced Interconnect …, 2007 | 6 | 2007 |
| Dielectric recoveries on O2 plasma damaged organosilicate low-k dielectrics H Shi, J Bao, J Liu, H Huang, RS Smith, Q Zhao, PS Ho, MD Goodner, ... Proceedings of the Advanced Metallization Conference 23, 447, 2007 | 5 | 2007 |
| Huang H and Ho PS MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ... J. Appl. Phys. 2013, 113, 2013 | 4 | 2013 |
| Fundamentals and Failures in die preparation for 3D packaging H Shi, E Poonjolai 3D Microelectronic Packaging: From Fundamentals to Applications, 101-128, 2017 | 3 | 2017 |
| Mechanistic Study of CO2 Plasma Damage to OSG Low k Dielectrics H Shi, J Bao, H Huang, B Chao, S Smith, Y Sun, PS Ho, A Li, M Armacost, ... 2008 International Interconnect Technology Conference, 31-33, 2008 | 3 | 2008 |
Jean-Francois de MarneffePrincipal Member of Technical Staff at imec vzw在 imec.be 的电子邮件经过验证
Jean-Francois de MarneffePrincipal Member of Technical Staff at imec vzw在 imec.be 的电子邮件经过验证
Denis ShamiryanDirector of Operations, Keen Semiconductors (Secure Foundry)在 securefoundry.com 的电子邮件经过验证