| Spectral phonon scattering from sub-10 nm surface roughness wavelengths in metal-assisted chemically etched Si nanowires MG Ghossoub, KV Valavala, M Seong, B Azeredo, K Hsu, JS Sadhu, ... Nano letters 13 (4), 1564-1571, 2013 | 75 | 2013 |
| Transient heat release during induced mitochondrial proton uncoupling MC Rajagopal, JW Brown, D Gelda, KV Valavala, H Wang, DA Llano, ... Communications biology 2 (1), 279, 2019 | 47 | 2019 |
| Fabrication and characterization of thermocouple probe for use in intracellular thermometry MC Rajagopal, KV Valavala, D Gelda, J Ma, S Sinha Sensors and Actuators A: Physical 272, 253-258, 2018 | 22 | 2018 |
| Specularity of longitudinal acoustic phonons at rough surfaces D Gelda, MG Ghossoub, K Valavala, J Ma, MC Rajagopal, S Sinha Physical Review B 97 (4), 045429, 2018 | 17 | 2018 |
| Peak thermoelectric power factor of holey silicon films J Ma, D Gelda, KV Valavala, S Sinha Journal of Applied Physics 128 (11), 2020 | 11 | 2020 |
| Bump integrated thermoelectric cooler K Lofgreen, CM Jha, KV Valavala US Patent 11,658,095, 2023 | 7 | 2023 |
| Thermal Engineering at the Limits of the CMOS Era KV Valavala, KD Coulson, MC Rajagopal, D Gelda, S Sinha Handbook of Thin Film Deposition (Fourth Edition), 63-101, 2018 | 5 | 2018 |
| An exploration of measuring lower-length-scale structures in nuclear materials: Thermal conductivity of U-Mo fuel particle Y Miao, MC Rajagopal, K Valavala, K Mo, ZG Mei, S Bhattacharya, ... Journal of Nuclear Materials 527, 151797, 2019 | 4 | 2019 |
| Carbonation Characteristics of Isolated Calcium Oxide Nanoparticles for Thermal Energy Storage KV Valavala, H Tian, S Sinha Nanoscale and Microscale Thermophysical Engineering 17 (3), 204-215, 2013 | 4 | 2013 |
| Thermoelectric cooler to enhance thermal-mechanical package performance Z Wan, KV Valavala, CM Jha, S Devasenathipathy US Patent App. 16/362,961, 2020 | 3 | 2020 |
| Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios KV Valavala, RV Mahajan, CM Jha US Patent 11,664,293, 2023 | 1 | 2023 |
| Thermal management of base dies in multichip composite devices A Elsherbini, W Li, BJ Krishnatreya, D Mallik, KV Valavala, L Jiang, ... US Patent App. 17/891,738, 2024 | | 2024 |
| Photonic quasi-monolithic die architectures AA Elsherbini, D Hui, HK Niazi, W Li, BJ Krishnatreya, H Braunisch, ... US Patent App. 17/821,019, 2024 | | 2024 |
| Thermally enhanced structural member and/or bond layer for multichip composite devices A Elsherbini, F Eid, S Kellar, Y Tomita, R Mongia, K Jun, S Liff, W Li, ... US Patent App. 17/891,735, 2024 | | 2024 |
| Quasi-monolithic die architectures AA Elsherbini, KV Valavala, K Jun, SM Liff, JM Swan, D Mallik, F Eid, ... US Patent App. 17/821,009, 2024 | | 2024 |
| Modular package architecture for voltage regulator-compute-memory circuits with quasi-monolithic chip layers AA Elsherbini, K Radhakrishnan, A Augustine, B Choi, K Jun, ... US Patent App. 17/820,982, 2024 | | 2024 |
| Integrated conformal thermal heat spreader for multichip composite devices ME Kabir, BJ Krishnatreya, K Jun, A Elsherbini, T Talukdar, F Eid, D Mallik, ... US Patent App. 17/891,727, 2024 | | 2024 |
| Package architecture for quasi-monolithic chip with backside power AA Elsherbini, SM Liff, D Mallik, CM Pelto, K Jun, JM Swan, L Jiang, F Eid, ... US Patent App. 17/820,961, 2024 | | 2024 |
| Vapor chamber integrated heat spreader (ihs) with liquid reservoir G Patankar, S Devasenathipathy, KV Valavala US Patent App. 17/693,003, 2023 | | 2023 |
| Package architecture including thermoelectric cooler structures KV Valavala, R Mahajan, CM Jha, K Lofgreen, W Tang US Patent 11,756,856, 2023 | | 2023 |
Sanjiv SinhaAsst. Professor of Mechanical Engineering, University of Illinois在 illinois.edu 的电子邮件经过验证
