| The role of intermetallic compounds in controlling the microstructural, physical and mechanical properties of Cu-[Sn-Ag-Cu-Bi]-Cu solder joints R Sayyadi, H Naffakh-Moosavy Scientific reports 9 (1), 8389, 2019 | 75 | 2019 |
| Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability F Khodabakhshi, R Sayyadi, NS Javid Materials Science and Engineering: A 702, 371-385, 2017 | 59 | 2017 |
| Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x= 0, 1, 2.5, 5 wt%) solders R Sayyadi, H Naffakh-Moosavy Materials Science and Engineering: A 735, 367-377, 2018 | 50 | 2018 |
| Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn–Ag–Cu/Cu soldered joint R Sayyadi, F Khodabakhshi, NS Javid, G Khatibi Journal of Materials Research and Technology 9 (4), 8953-8970, 2020 | 29 | 2020 |
| Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment NS Javid, R Sayyadi, F Khodabakhshi Journal of Materials Science: Materials in Electronics 30, 4737-4752, 2019 | 13 | 2019 |
Farzad KhodabakhshiUniversity of Tehran在 ut.ac.ir 的电子邮件经过验证
Farzad KhodabakhshiUniversity of Tehran在 ut.ac.ir 的电子邮件经过验证
Homam Naffakh-Moosavy, PhDAssociate Professor of Materials Engineering, Tarbiat Modares University, Tehran, Iran在 modares.ac.ir 的电子邮件经过验证