| Adhesion and reliability of direct Cu metallization of through-package vias in glass interposers T Huang, V Sundaram, PM Raj, H Sharma, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2266-2270, 2014 | 16 | 2014 |
| High frequency electrical performance and thermo-mechanical reliability of fine-pitch, copper-metallized through-package-vias (tpvs) in ultra-thin glass interposers S Viswanathan, T Ogawa, K Demir, TB Huang, PM Raj, F Liu, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1510-1516, 2017 | 7 | 2017 |
| Novel copper metallization schemes on ultra-thin, bare glass interposers with through-vias T Huang, B Chou, V Sundaram, H Sharma, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1208-1212, 2015 | 6 | 2015 |
| Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy K Ramachandran, TL Pruyn, T Huang, Y Wang, PM Singh, W Jud Ready, ... Journal of Materials Science: Materials in Electronics 26, 2563-2570, 2015 | 6 | 2015 |
| Electroanalytical study of organic additive interactions in copper plating and their correlation with via fill behavior TB Huang, H Sharma, R Manepalli, S Kandanur, V Sundaram, ... Journal of Electronic Materials 47, 7401-7408, 2018 | 5 | 2018 |
| Via-first process to enable copper metallization of glass interposers with high-aspect-ratio, fine-pitch through-package-vias TB Huang, B Chou, J Tong, T Ogawa, V Sundaram, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017 | 5 | 2017 |
| Determination of energy release rate through sequential crack extension S McCann, GT Ostrowicki, A Tran, T Huang, T Bernhard, RR Tummala, ... Journal of Electronic Packaging 139 (4), 041003, 2017 | 2 | 2017 |
| Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers T Huang Georgia Institute of Technology, 2017 | 1 | 2017 |
| High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer V Sundaram, J Tong, K Demir, T Huang, A Shorey, S Pollard, R Tummala International Symposium on Microelectronics 2014 (1), 000402-000408, 2014 | 1 | 2014 |
