| On-chip cooling by superlattice-based thin-film thermoelectrics I Chowdhury, R Prasher, K Lofgreen, G Chrysler, S Narasimhan, ... Nature nanotechnology 4 (4), 235-238, 2009 | 1001 | 2009 |
| Turning carbon nanotubes from exceptional heat conductors into insulators RS Prasher, XJ Hu, Y Chalopin, N Mingo, K Lofgreen, S Volz, F Cleri, ... Physical Review Letters 102 (10), 105901, 2009 | 407 | 2009 |
| Ultralow thermal conductivity of nanoparticle packed bed XJ Hu, R Prasher, K Lofgreen Applied Physics Letters 91 (20), 2007 | 66 | 2007 |
| Thermal control of device using fluid coolant Z Li, RM Kirby, JF Walczyk, KP Lofgreen US Patent App. 13/844,192, 2014 | 23 | 2014 |
| Feasibility study of using solid state refrigeration technologies for electronic cooling DS Chau, G Chrysler, S Narasimhan, D Ganapathy, K Lofgreen Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 16 | 2006 |
| Bump integrated thermoelectric cooler K Lofgreen, CM Jha, KV Valavala US Patent 11,658,095, 2023 | 14 | 2023 |
| Cooling of electronics using folded foil microchannels A Choudhury, P Nardi, WN Labanok, KP Lofgreen US Patent App. 14/757,997, 2017 | 14 | 2017 |
| Foam composite ZZ Tang, S Jain, W Hu, MA Schroeder, RS Sidhu, CL Deppisch, P Nardi, ... US Patent 10,651,108, 2020 | 12 | 2020 |
| Methods of forming serpentine thermal interface material and structures formed thereby P Nardi, KP Lofgreen US Patent 9,230,877, 2016 | 10 | 2016 |
| Thin film thermoelectric cooler thermal validation and product thermal performance estimation S Narasimhan, K Lofgreen, D Chau, G Chrysler Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 10 | 2006 |
| Methods of forming serpentine thermal interface material and structures formed thereby P Nardi, KP Lofgreen US Patent 9,418,912, 2016 | 9 | 2016 |
| Site-specific and on-demand high heat-flux cooling using superlattice based thin-film thermoelectrics I Chowdhury, R Prasher, K Lofgreen, S Narasimhan, R Mahajan, ... International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 8 | 2009 |
| Effects of chemical intermixing on electrical and thermal contact conductances at metallized bismuth and antimony telluride interfaces D Devender, RJ Mehta, K Lofgreen, R Mahajan, M Yamaguchi, ... Journal of Vacuum Science & Technology A 33 (2), 2015 | 7 | 2015 |
| Thermal interface techniques and configurations H Arora, LD Decesare, KP Lofgreen, AC Lyman, MA Schroeder US Patent App. 13/907,454, 2014 | 7 | 2014 |
| Energy storage material for thermal management and associated techniques and configurations J Krajniak, T Harirchian, KP Lofgreen, JC Matayabas Jr, NR Raravikar, ... US Patent App. 15/553,932, 2018 | 6 | 2018 |
| Filled liquid metal thermal interface materials KJ Arrington, A Mccann, K Lofgreen, AR Antoniswamy, ... US Patent App. 16/662,562, 2021 | 5 | 2021 |
| Semiconductor package with sealed thermal interface cavity with low thermal resistance liquid thermal interface material BM Rawlings, F Eid, K Lofgreen US Patent App. 16/016,399, 2019 | 5 | 2019 |
| Liquid metal TIM with STIM-like performance with no BSM and BGA compatible K Lofgreen, CP Chiu, J Petrini, E Cetegen, B Gebrehiwot, F Eid US Patent 11,551,994, 2023 | 4 | 2023 |
| A metrology for comprehensive thermoelectric device characterization K Lofgreen Arizona State University, 2011 | 4 | 2011 |
| Use-condition thermal metrics for characterization of thin film TEC modules on electronic packages S Narasimhan, D Ganapathy, G Chrysler, D Chau, K Lofgreen Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 4 | 2006 |
