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Ze Wang
标题
引用次数
引用次数
年份
Real-Time Aging Monitoring for IGBT Modules Using Case Temperature
Z Wang, B Tian, W Qiao, L Qu
Industrial Electronics, IEEE Transactions on 63 (2), 1168-1178, 2016
1252016
A physics-based improved cauer-type thermal equivalent circuit for IGBT modules
Z Wang, W Qiao
IEEE Transactions on Power Electronics 31 (10), 6781-6786, 2016
782016
Monitoring IGBT's health condition via junction temperature variations
B Tian, W Qiao, Z Wang, T Gachovska, JL Hudgins
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014 …, 2014
522014
An effective heat propagation path-based online adaptive thermal model for IGBT modules
Z Wang, W Qiao, B Tian, L Qu
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 513-518, 2014
512014
An online frequency-domain junction temperature estimation method for IGBT modules
Z Wang, W Qiao
IEEE Transactions on Power Electronics 30 (9), 4633-4637, 2015
412015
A real-time adaptive IGBT thermal model based on an effective heat propagation path concept
Z Wang, W Qiao, L Qu
IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020
252020
Study on case temperature distribution for condition monitoring of multidie IGBT modules
B Tian, Z Wang, W Qiao
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014 …, 2014
212014
Monitoring aging of power semiconductor devices based on case temperature
W Qiao, Z Wang, L Qu
US Patent 10,288,672, 2019
92019
Real-time junction temperature estimation for IGBT modules using low-order digital filters
Z Wang, W Qiao, L Qu
Power Electronics and Motion Control Conference (IPEMC-ECCE Asia), 2016 IEEE …, 2016
62016
Frequency-domain transient temperature estimation and aging analysis for weak points of IGBT modules
Z Wang, W Qiao, L Qu
2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4036-4042, 2014
52014
Real-time internal temperature estimation and health monitoring for IGBT modules
Z Wang
The University of Nebraska-Lincoln, 2017
42017
Inverter system
Y Zhou, TS Lin, Y Gui, Z Wang, K Klesyk
US Patent US20210257927A1, 2021
22021
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