| Wafer-level vacuum packaging of smart sensors A Hilton, DS Temple Sensors 16 (11), 1819, 2016 | 75 | 2016 |
| Fabrication and testing of a TSV-enabled Si interposer with Cu-and polymer-based multilevel metallization J Lannon, A Hilton, A Huffman, M Butler, D Malta, C Gregory, D Temple IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 39 | 2013 |
| Low-cost uncooled VOx infrared camera development C Li, CJ Han, GD Skidmore, G Cook, K Kubala, R Bates, D Temple, ... Infrared Technology and Applications XXXIX 8704, 465-474, 2013 | 25 | 2013 |
| 66‐3: Invited Paper: Colloidal Quantum Dot Photodetectors for Large Format NIR, SWIR, and eSWIR Imaging Arrays C Gregory, A Hilton, K Violette, EJD Klem SID Symposium Digest of Technical Papers 52 (1), 982-986, 2021 | 21 | 2021 |
| Extended SWIR high performance and high definition colloidal quantum dot imagers S Hinds, E Klem, C Gregory, A Hilton, G Hames, K Violette Infrared Technology and Applications XLVI 11407, 11-19, 2020 | 17 | 2020 |
| Towards low-cost infrared imagers: how to leverage Si IC ecosystem DS Temple, A Hilton, EJD Klem Technologies for Optical Countermeasures XIII 9989, 57-63, 2016 | 12 | 2016 |
| Wafer-level vacuum packaging of microbolometer-based infrared imagers A Hilton, D Temple, J Lannon, T Schimert, R Gooch, C Trujillo, ... Proceedings of the International Wafer-Level Packaging Conference, San Jose …, 2016 | 9 | 2016 |
| Process integration and testing of TSV Si interposers for 3D integration applications J Lannon, A Hilton, A Huffman, M Lueck, E Vick, S Goodwin, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 268-273, 2012 | 7 | 2012 |
| High-definition broad-band visible-SWIR sensors for laser mark detection JA Hilton, S Wyman, C Garcia, R Stewart, C Campbell, EJD Klem Infrared Technology and Applications XLIX 12534, 20-28, 2023 | 5 | 2023 |
| Colloidal quantum dot sensor bandwidth and thermal stability: progress and outlook C Gregory, JA Hilton, K Violette, S Shefte, C Procida, T Tessema, M Bond, ... Infrared Technology and Applications XLVIII 12107, 13-20, 2022 | 3 | 2022 |
| High current density electron emission from an electrodeposited metal nanowire array T Aloui, MP Kirley, E Vick, A Hilton, P Colon, W Kim, CB Parker, ... Journal of Vacuum Science & Technology B 38 (4), 2020 | 2 | 2020 |
| Photodetectors Having Optical Grating Couplers Integrated Therein and Related Methods S Hinds, EJD Klem, CW Gregory, JA Hilton, GA Hames US Patent App. 17/532,299, 2022 | 1 | 2022 |
| Colloidal Quantum Dot (CQD) Photodetectors and Related Devices E Klem, S Hinds, C Gregory, JA Hilton US Patent App. 17/199,971, 2021 | 1 | 2021 |
| Wafer-to-wafer bonding for hermetic and vacuum packaging of smart sensors DS Temple, A Hilton 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 1 | 2017 |
| High-resolution SWIR sensors and cameras RJ Stewart Jr, E Klem, A Hilton Infrared Technology and Applications L 13046, 130460C, 2024 | | 2024 |
| High-definition broad-band visible-SWIR sensors for laser mark detection EJDK J.A. Hilton, S. Wyman, C. Garcia, R. Stewart, C. Campell Proceedings Volume 12534, Infrared Technology and Applications XLIX, 2023 | | 2023 |
| Optical depth sensing systems using high speed colloidal quantum dot photodetectors EJD Klem, CW Gregory, JA Hilton, C Procida, M Bond, T Tessema US Patent App. 18/060,171, 2023 | | 2023 |
| Colloidal Quantum Dot Photodetectors Having Thin Encapsulation Layers Thereon and Methods of Fabricating the Same EJD Klem, C Gregory, JA Hilton, MA Bond, KE Violette US Patent App. 17/578,979, 2022 | | 2022 |
| Colloidal quantum dot sensor to disrupt SWIR imaging market: Spin-out firm SWIR Vision Systems is to commercialise colloidal quantum dot infrared sensors, which, it says, could … E Klem, A Hilton, G Wildeman Imaging and Machine Vision Europe, 2018 | | 2018 |
| Process integration, improvements, and testing of Si interposers for embedded computing applications S Goodwin, J Lannon, A Hilton, A Huffman, M Lueck, E Vick, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 8-12, 2014 | | 2014 |
Ethan KlemSWIR Vision Systems在 swirvisionsystems.com 的电子邮件经过验证
Ethan KlemSWIR Vision Systems在 swirvisionsystems.com 的电子邮件经过验证